Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
PCB Market Expanding at 3.62% CAGR, To Reach $100 Billion by 2032
January 17, 2025 | EINPresswire.comEstimated reading time: Less than a minute
The global Printed Circuit Board (PCB) Market was valued at US$72.63 billion in 2023 and is projected to exhibit steady growth over the coming years. The market is expected to reach US$75.26 billion in 2024 and grow further to USD 100.0 billion by 2032, representing a compound annual growth rate (CAGR) of 3.62% during the forecast period (2025-2032). The consistent demand for electronics and advancements in technology are the primary drivers for the PCB market.
Key Drivers of Market Growth
1. Technological Advancements: The rapid development of new technologies, such as 5G, artificial intelligence (AI), and the Internet of Things (IoT), is boosting the demand for advanced PCBs.
2. Rising Demand in Consumer Electronics: The proliferation of smartphones, wearables, and home appliances is fueling PCB market growth.
3. Growth in Automotive Electronics: Increasing integration of electronic components in vehicles, such as infotainment systems, safety systems, and electric vehicle (EV) components, is driving PCB demand.
4. Industrial Automation: The adoption of robotics and automation in industries requires advanced PCBs, contributing to market expansion.
5. Global Shift Toward Renewable Energy: The need for PCBs in solar panels and wind turbines is expected to rise as renewable energy becomes more widespread.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.