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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

I-Connect007 Welcomes Michael Gleason as New Columnist

10/14/2026 | I-Connect007
I-Connect007 welcomes Michael Gleason, director of product development and strategic growth at GreenSource Fabrication, as its newest columnist. His monthly column, Built for What’s Next, will appear in I-Connect007 Magazine, offering a forward-looking perspective on PCB design, advanced manufacturing, and the technologies shaping the next generation of electronics. With more than 20 years of experience in PCB manufacturing, Gleason brings a combination of engineering expertise, operational leadership, and practical knowledge of advanced fabrication.

Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates

10/13/2026 | SEMI
Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported today in its latest 300mm Fab Outlook. Investment is expected to continue growing at double-digit rates through 2029, reaching $227 billion.

I-Connect007 Welcomes Newest Columnist, Echo Yang of Archer Circuits

10/12/2026 | I-Connect007
I-Connect007 is excited to welcome Echo Yang, founder and president of Archer Circuits, as its newest columnist. As a female owner of a large Asian PCB company, Echo brings her candid, energetic, and practical view of the global PCB business to her column, The Fearless Connector. She will address the differences between Chinese and North American manufacturing, her own struggles to start a business, and some details about DFM, engineering, Gerber files, and the risks of treating RF, rigid-flex, and other demanding products like ordinary FR-4 work. She approaches it all with her own youthful, entrepreneurial spirit.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.

VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore

09/28/2026 | Globe Newswire
VisionPower Semiconductor Manufacturing Company Pte. Ltd. (VSMC), the joint venture established in September 2024 by Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors N.V., marked the grand opening of its first 12-inch (300mm) fab in Tampines, Singapore.
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