Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection
January 23, 2025 | iNEMIEstimated reading time: Less than a minute
Register today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.
The transition from 2.5D to 3D packaging technologies like CoWoS, HBM, wafer-to-wafer stacking, and hybrid bonding brings significant challenges in ensuring reliability and performance during testing and inspection. This free iNEMI Packaging Tech Topic Webinar will address these challenges and explore cutting-edge solutions.
Key Webinar Takeaways:
- Evolving requirements in test and inspection for 3D packaging
- Overcoming hurdles in defect detection, alignment accuracy, and high-volume production throughput
- Emerging technologies that future-proof test strategies for 3D packaging
Featured Speaker:
Charlie Zhu, Ph.D., Senior Director of R&D, Nordson ATS
A seasoned technologist with extensive expertise in semiconductor test and inspection
When:
- Thursday, February 13, 2025
- 8:00-9:00 AM EST (U.S.)
- 2:00-3:00 PM CST (Europe)
- 10:00-11:00 PM JST (Japan)
Register Now
Space is limited, so register today to secure your spot. This webinar is open to industry professionals and advance registration is required. Click here to register.
Share on:
Suggested Items
INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI
05/02/2025 | iNEMIIn semiconductor manufacturing, the ability to analyze vast amounts of high-dimensional data is critical for ensuring product quality and optimizing wafer yield.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
INEMI Sustainable Electronics Tech Topic Webinar: Enabling New Life in Storage Devices
04/17/2025 | iNEMIHard disk drives (HDDs) and solid state drives (SSDs) are ubiquitous in electronic products and a large number enter the end-of-life stream prior to their true end of life.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/11/2025 | Marcy LaRont, I-Connect007The word for this week (again) is tariffs. Another week has gone by, and the tariff mandates continue with neither the U.S. or China backing down on a course that could be disastrous for businesses and the economy in the short term. As we all wait and watch the geopolitical volley, our businesses forge ahead. As one industry leader recently said, “We’ve been through this before.” Well, maybe not exactly this, but the resilience of our industry and business leaders has been proven over and over, decade upon decade. Check out our coverage of the latest IPC tariff webinar, which includes a snapshot of the tariff situation as it stands now. But it's not over, not by a long shot.