Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection
January 23, 2025 | iNEMIEstimated reading time: Less than a minute
Register today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.
The transition from 2.5D to 3D packaging technologies like CoWoS, HBM, wafer-to-wafer stacking, and hybrid bonding brings significant challenges in ensuring reliability and performance during testing and inspection. This free iNEMI Packaging Tech Topic Webinar will address these challenges and explore cutting-edge solutions.
Key Webinar Takeaways:
- Evolving requirements in test and inspection for 3D packaging
- Overcoming hurdles in defect detection, alignment accuracy, and high-volume production throughput
- Emerging technologies that future-proof test strategies for 3D packaging
Featured Speaker:
Charlie Zhu, Ph.D., Senior Director of R&D, Nordson ATS
A seasoned technologist with extensive expertise in semiconductor test and inspection
When:
- Thursday, February 13, 2025
- 8:00-9:00 AM EST (U.S.)
- 2:00-3:00 PM CST (Europe)
- 10:00-11:00 PM JST (Japan)
Register Now
Space is limited, so register today to secure your spot. This webinar is open to industry professionals and advance registration is required. Click here to register.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI
05/02/2025 | iNEMIIn semiconductor manufacturing, the ability to analyze vast amounts of high-dimensional data is critical for ensuring product quality and optimizing wafer yield.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
INEMI Sustainable Electronics Tech Topic Webinar: Enabling New Life in Storage Devices
04/17/2025 | iNEMIHard disk drives (HDDs) and solid state drives (SSDs) are ubiquitous in electronic products and a large number enter the end-of-life stream prior to their true end of life.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.