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KOKI to Host Technical Webinar on Dewetting Defects in SMT Soldering
November 11, 2025 | KOKIEstimated reading time: 1 minute
KOKI, a global leader in advanced soldering materials and process solutions, announced its upcoming technical webinar, “Understanding and Preventing Dewetting Defects in SMT Soldering.”
The session will be presented by Shantanu Joshi, Head of Customer Solutions and Operational Excellence at Koki Solder America, on Thursday, November 20, 2025, at 1:00 PM ET.
Dewetting remains one of the most prevalent and costly defects in surface-mount technology (SMT) manufacturing, accounting for nearly 20% of all defect analysis requests received by KOKI Americas. This condition—where molten solder fails to completely wet the pad or component surface—can result in weak joints, electrical performance issues, and reduced long-term reliability if not properly understood and controlled.
In this webinar, Shantanu Joshi will draw upon over a decade of field case studies conducted through KOKI’s industry-recognized Defect Analysis Service, offering actionable insights into:
- Root causes of dewetting across materials, processes, and surface finishes
- Its effect on solder joint strength and overall reliability
- Proven prevention and mitigation strategies using optimized flux chemistry and process control
“This session is designed to bridge the gap between laboratory analysis and production reality,” said Joshi. “By understanding why dewetting occurs and how to identify it early, manufacturers can significantly improve yield and reduce costly rework.”
The webinar is ideal for process engineers, quality managers, and manufacturing professionals seeking to enhance process stability, improve yield, and strengthen reliability performance. Participation is free, but registration is required.
Register through the link: https://meet.zoho.com/LBzN-noj-p9y
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