Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

£13M Boost for Next-Gen Satellite Communications for Trains and Farmers

08/21/2026 | UK Space Agency
More reliable broadband on remote Scottish railways and affordable sensors which help farmers grow more food are among a raft of new projects which will bring the benefits of space technology into everyday life.

Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging

04/20/2026 | Marcy LaRont, I-Connect007
The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.

New Global Electronics Association Report Examines FCC Router Restrictions and Supply Chain Challenges

04/10/2026 | Global Electronics Association
The Global Electronics Association today released a new report, “Routers, Restrictions, and Reality: The FCC’s Latest Supply Chain Curveball,” examining the Federal Communications Commission’s March 2026 decision to add all foreign-produced consumer routers to its Covered List.

CEA-Leti, CEA-List & PSMC Integrate RISC-V and MicroLED Silicon Photonics for 3D AI Systems

04/03/2026 | CEA-List
CEA-Leti, a world-leading micro & nanotechnologies research institute, and CEA-List, a specialist in smart digital systems, announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC).
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in