Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Advanced Chip and Circuit Materials Shows 224 Gb/s Laminates and Prepregs at DesignCon 2025
January 27, 2025 | Advanced Chip and Circuit MaterialsEstimated reading time: Less than a minute
Advanced Chip and Circuit Materials, Inc. (ACCM) will be showing its high-performance circuit materials, including its Celeritas Series laminates and prepregs at the DesignCon 2025 exhibition (Santa Clara, CA). The US-based manufacturer will be on hand January 28-30, 2025, at Booth #901 with samples of its Celeritas SF and Celeritas BU products in support of PCIe Gen 6 & 7 multilayer printed circuit boards (PCBs) with data rates reaching 224 Gb/s per channel.
ACCM’s Vice President Marketing, Michael Gay, explained the importance of circuit materials with such high performance and outstanding stability, even in hostile operating environments: “We are confident that PCB designers will find that our skew free Celeritas SF material solution will enable use of on board copper channels to achieve 224 Gbps data rates.” The materials feature halogen-free, PFAS-free composition with minimal skew and low z-axis coefficient of thermal expansion (CTE) and can be processed with standard FR-4 circuit material processes and equipment. They are engineered high reliability in HDI and UHDI applications requiring superior thermal cycling capability.
Share on:
Suggested Items
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
NVIDIA RTX PRO 6000 Shipments Expected to Rise Amid Market Uncertainties
06/24/2025 | TrendForceThe NVIDIA RTX PRO 6000 has recently generated significant buzz in the market, with expectations running high for strong shipment performance driven by solid demand.