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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Advanced Chip and Circuit Materials Shows 224 Gb/s Laminates and Prepregs at DesignCon 2025
January 27, 2025 | Advanced Chip and Circuit MaterialsEstimated reading time: Less than a minute
Advanced Chip and Circuit Materials, Inc. (ACCM) will be showing its high-performance circuit materials, including its Celeritas Series laminates and prepregs at the DesignCon 2025 exhibition (Santa Clara, CA). The US-based manufacturer will be on hand January 28-30, 2025, at Booth #901 with samples of its Celeritas SF and Celeritas BU products in support of PCIe Gen 6 & 7 multilayer printed circuit boards (PCBs) with data rates reaching 224 Gb/s per channel.
ACCM’s Vice President Marketing, Michael Gay, explained the importance of circuit materials with such high performance and outstanding stability, even in hostile operating environments: “We are confident that PCB designers will find that our skew free Celeritas SF material solution will enable use of on board copper channels to achieve 224 Gbps data rates.” The materials feature halogen-free, PFAS-free composition with minimal skew and low z-axis coefficient of thermal expansion (CTE) and can be processed with standard FR-4 circuit material processes and equipment. They are engineered high reliability in HDI and UHDI applications requiring superior thermal cycling capability.
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