-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ElectroCraft Expands Ann Arbor Facility to Strengthen U.S. Manufacturing Independence and Reduce Lead Times
January 30, 2025 | PRNewswireEstimated reading time: 1 minute
ElectroCraft, a global leader in motor and motion control solutions, proudly announces the significant expansion of its Ann Arbor, Michigan facility. This strategic investment reinforces ElectroCraft's commitment to strengthening U.S. manufacturing independence, reducing reliance on global supply chains, and delivering faster lead times for its customers.
By increasing domestic production capacity, ElectroCraft enhances its ability to provide high-quality motion control solutions with greater speed and efficiency. The expanded facility ensures improved operational performance, enabling faster turnaround times and more reliable supply for customers across multiple industries.
Key Highlights of the Facility Expansion:
- Motion Control R&D Center: The expanded Ann Arbor facility will serve as a hub for motion control research and development. ElectroCraft's engineering team will focus on pioneering new technologies and refining existing products, ensuring customers benefit from the latest advancements in the industry, all produced within the U.S.
- Enhanced Motor Drive Design and Development: With increased space and resources dedicated to drive design, the Ann Arbor facility will accelerate ElectroCraft's ability to develop and prototype new DC motor drive solutions. This expansion allows for faster turnaround times on new designs and customization requests, strengthening ElectroCraft's position as a reliable, U.S.-based provider.
- In-House PCBA Production: The expansion includes state-of-the-art equipment for in-house PCBA production, enabling ElectroCraft to manufacture printed circuit board assemblies directly on-site. This vertical integration significantly reduces lead times, ensures stringent quality control, and eliminates reliance on overseas supply chains.
"We are pleased to announce the expansion of our Ann Arbor facility," said Scott Rohlfs, Global Marketing Director and General Manager of the Drives Business Unit at ElectroCraft. "This investment reflects our commitment to U.S. manufacturing independence, ensuring we can provide our customers with the fastest lead times and most reliable supply chain solutions while supporting American industry."
The expanded Ann Arbor facility is now fully operational and ready to support ElectroCraft's continued growth and leadership in the global motion control market.
Suggested Items
SIA Applauds CHIPS Act Incentives for Infinera, Corning, Edwards Vacuum, and GlobalFoundries
01/20/2025 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending a series of CHIPS and Science Act agreements announced by the U.S. Department of Commerce.
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
01/10/2025 | MicronMicron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility
01/08/2025 | U.S. Department of CommerceThe Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third flagship CHIPS for America research and development (R&D) facility.
SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
01/07/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging.