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TopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California. TopLine provides unique and innovative component-level solutions and learning tools including Daisy Chain Test Packages, very large BGA 2.5D Heterogeneous packages, Jumpers and Spacers for PCB, Glass Components for underfill practice, and more. TopLine also provides PCB test kits for solder practice and machine run.
TopLine engineers will be available in the booth to discuss all of the various products and technologies that the company supplies.
For example, Founder and CEO Martin Hart recently announced the availability of Braided Solder Columns as drop-in replacements for BGA balls for Quantum Computers, Aerospace, and many next-generation applications, including Very Large 2.5D Packages.
TopLine is a pioneer in CGA Solder Columns Technology and Low temperature cryogenic package-to-board interconnects. TopLine is also a supplier of Bonding Wire for many semiconductor uses and for EV applications.
