Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
TopLine Bringing Answers, New Ideas to APEX 2025
February 4, 2025 | TopLineEstimated reading time: Less than a minute
TopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California. TopLine provides unique and innovative component-level solutions and learning tools including Daisy Chain Test Packages, very large BGA 2.5D Heterogeneous packages, Jumpers and Spacers for PCB, Glass Components for underfill practice, and more. TopLine also provides PCB test kits for solder practice and machine run.
TopLine engineers will be available in the booth to discuss all of the various products and technologies that the company supplies.
For example, Founder and CEO Martin Hart recently announced the availability of Braided Solder Columns as drop-in replacements for BGA balls for Quantum Computers, Aerospace, and many next-generation applications, including Very Large 2.5D Packages.
TopLine is a pioneer in CGA Solder Columns Technology and Low temperature cryogenic package-to-board interconnects. TopLine is also a supplier of Bonding Wire for many semiconductor uses and for EV applications.
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
01/16/2025 | TopLine CorporationTopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.
TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego
01/09/2025 | TopLineTopLine Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.
TopLine to Exhibit 'Drop-in Replacement' for BGA at Electronica
10/16/2024 | TopLineTopLine Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 12 – 15, 2024, in stand B4.428.
TopLine, TANAKA to Co-exhibit at IPC APEX 2024
03/06/2024 | TopLineTopLine Corporation will co-exhibit in booth #1231 with Tanaka Precious Metals at the upcoming IPC APEX 2024 conference and exhibition at the Anaheim Convention Center, Anaheim, California, April 9 – 11.