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Laser Photonics Propels R&D Efforts in Wafer Marking
February 4, 2025 | BUSINESS WIREEstimated reading time: 1 minute
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired subsidiary, Control Micro Systems, Inc. (CMS Laser), announced the expansion of their Laser Wafer Marking technology research and development program.
High-precision Laser Wafer Marking technologies are designed for engraving serial numbers and other critical information on silicon and compounds used in the semiconductor industry.
“By integrating CMS Laser’s expertise with our advanced R&D initiatives, we are committed to providing chip manufacturers with the most sophisticated laser wafer processing systems,” said John Armstrong, Executive Vice President of LPC. “We are ready to support fabs in the United States and abroad amidst the ever-growing demand for chips and the regulatory stimulation of the sector.”
CMS Laser’s cutting-edge laser marking technology is designed with custom configurations for each client, including the laser type, product transport and handling, machine vision, and fume extraction. Engineers can tailor the process to accommodate virtually all specific needs, including integrating seamlessly with existing databases, connecting to sophisticated Surface Mount Technology (SMT) lines, incorporating external stackers and destackers, adopting various flipping configurations, or robotics integration.
CMS Laser prides itself on working with the end user to create a solution that integrates into their manufacturing environment and accepts engineering challenges that other laser system companies turn down.
Developed to meet the most demanding requirements, CMS Laser’s laser marking systems deliver unrivaled performance, making them an indispensable asset in advanced wafer processing. Chip manufacturers can rely on these innovative systems to enhance production, with precision, speed, and adaptability providing a remarkable competitive edge, ensuring accurate, uniform results in every batch.
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Altus Supports Ei Electronics with LPKF Laser Depaneling Technology
03/09/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics manufacturing industry, has supported Ei Electronics, Ireland’s largest manufacturer of home life-safety devices, with the installation of an LPKF CuttingMaster 2240 laser depaneling system to enhance PCB singulation and support growing production volumes.
Semtech Expands Data Center Portfolio with Acquisition of HieFo Corporation
03/05/2026 | SemtechSemtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.
Mycronic Wins SLX Mask Writer Order in Asia
01/09/2026 | MycronicMycronic AB has received an order for an SLX mask writer from a new customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the first quarter of 2026.
Fresh PCB Concepts: Choosing Via Types—A Practical Guide for PCB Engineers
12/18/2025 | Team NCAB -- Column: Fresh PCB ConceptsWhen you first learn PCB routing, vias look like plumbing: holes that let signals pass between layers. As designs become denser and products shrink, vias develop from simple interconnects into deliberate engineering choices. Selecting between through-hole, blind, buried, microvia, or advanced options like skip vias is a balancing act between electrical performance, manufacturability, cost, and long-term reliability. In HDI boards, via strategy is as consequential as the stackup, material selection, or component placement.
AI Boom Sparks Laser Crunch as Nvidia Tightens Grip on Supply Chain
12/08/2025 | TrendForceTrendForce’s recent research indicates that high-speed optical interconnects are now central to performance and scalability, especially as AI data centers grow into large clusters.