It’s Only Common Sense: Stop Pretending Your Customers Are Loyal
Happy’s Tech Talk #44: Memories of the ‘Mystery Systems of the East’
Indium Expert to Address Thermal Challenges at TestConX 2025
February 4, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
The presentation, Solving Warping Issues with Novel Metal Compressible TIM, will introduce innovative compressible metal thermal interface materials (TIMs) designed to improve thermal performance in high-power applications. These TIMs feature a specially engineered one-sided pattern that enhances compressibility, making them highly effective in addressing warping, non-planarities, and CTE mismatches between connecting surfaces. Ideal for challenging applications like TIM1 or TIM1.5, these materials are particularly suited for warped, irregular, or curved surfaces.
“At Indium Corporation, we are committed to advancing thermal interface materials to help our customers overcome the unique challenges of high-power applications,” said Burt. “These novel TIMs address a critical need: improving reliability and efficiency in increasingly complex thermal environments.”
Burt is a Technical Support Engineer at Indium Corporation's global headquarters in Clinton, N.Y. He is responsible for providing technical assistance to optimize the selection and use of Indium Corporation's materials, as well as providing product and process training. Burt earned his bachelor's degree in chemistry from Clarkson University in Potsdam, N.Y. He is also a Certified SMT Process Engineer (CSMTPE).
TestConX 2025 visitors can attend the presentation on Tuesday, March 4, at 1:30 p.m. For more information on Indium Corporation’s TIMs products, visit Burt and additional Indium Corporation experts at booth #45, or visit www.indium.com/TIMs.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Present on Power Electronics at productronica 2025
11/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.
Indium to Feature Thermal Materials Solutions for High-Performance Computing at SC25
11/13/2025 | Indium CorporationAs one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and other high-reliability products at The International Conference for High Performance Computing, Networking, Storage, and Analysis (SC25), taking place November 16-21, in St. Louis, Missouri.
Indium Promotion Reflects Hertline’s Leadership in Advancing Innovative Soldering Solutions for Power Electronics
11/07/2025 | Indium CorporationAs industries worldwide accelerate toward electrification, automation, and smarter technologies, Indium Corporation, a global leader in advanced materials, is strengthening its leadership in engineered solder materials (ESM) to meet the growing demand for innovative, high-reliability solutions.
Indium Leaders Receive SMTA Next Gen 10 Awards at SMTA International
11/04/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces that Senior Product Development Specialist Kevin Brennan and Marketing Communications Specialist Jordan Carroll were recognized with SMTA Next Gen 10 Awards at SMTA International (SMTAI), held October 19-23 in Rosemont, Illinois.
Real Time with... SMTAI 2025: Innovations in Solder Materials— Kevin Brennan's Journey at Indium
11/05/2025 | Real Time with...SMTAIIn this interview from SMTAI 2025, Kevin Brennan shares his five-year journey at Indium Corporation, where he has worked in R&D, process engineering, and product management. Indium focuses on engineered solder materials, introducing new products like halogen-free and high-temperature alloys to meet industry challenges. The discussion covers a shift to low-temperature alloys to reduce warpage in larger chips and highlights the Indium 12.9 HF flux for high-density boards. Kevin reflects on the supportive community at Indium.