It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Marcy's Musings: It's Show Time!
Indium Expert to Address Thermal Challenges at TestConX 2025
February 4, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
The presentation, Solving Warping Issues with Novel Metal Compressible TIM, will introduce innovative compressible metal thermal interface materials (TIMs) designed to improve thermal performance in high-power applications. These TIMs feature a specially engineered one-sided pattern that enhances compressibility, making them highly effective in addressing warping, non-planarities, and CTE mismatches between connecting surfaces. Ideal for challenging applications like TIM1 or TIM1.5, these materials are particularly suited for warped, irregular, or curved surfaces.
“At Indium Corporation, we are committed to advancing thermal interface materials to help our customers overcome the unique challenges of high-power applications,” said Burt. “These novel TIMs address a critical need: improving reliability and efficiency in increasingly complex thermal environments.”
Burt is a Technical Support Engineer at Indium Corporation's global headquarters in Clinton, N.Y. He is responsible for providing technical assistance to optimize the selection and use of Indium Corporation's materials, as well as providing product and process training. Burt earned his bachelor's degree in chemistry from Clarkson University in Potsdam, N.Y. He is also a Certified SMT Process Engineer (CSMTPE).
TestConX 2025 visitors can attend the presentation on Tuesday, March 4, at 1:30 p.m. For more information on Indium Corporation’s TIMs products, visit Burt and additional Indium Corporation experts at booth #45, or visit www.indium.com/TIMs.
Share on:
Suggested Items
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Expert to Present on Gold Solder Solutions for Medical Applications at IMAPS 2025 Workshop
02/26/2025 | Indium CorporationIndium Corporation Senior Product Specialist Jason Farrell will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop, taking place March 5-7 in Phoenix Arizona.
Indium to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
01/22/2025 | Indium CorporationIndium Corporation will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California. SPIE West is the world’s premier event for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.
Indium Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025
01/16/2025 | Indium CorporationIndium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.
Indium to Showcase Power Electronics Products at NEPCON Japan
01/14/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.