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Indium Expert to Address Thermal Challenges at TestConX 2025
February 4, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
The presentation, Solving Warping Issues with Novel Metal Compressible TIM, will introduce innovative compressible metal thermal interface materials (TIMs) designed to improve thermal performance in high-power applications. These TIMs feature a specially engineered one-sided pattern that enhances compressibility, making them highly effective in addressing warping, non-planarities, and CTE mismatches between connecting surfaces. Ideal for challenging applications like TIM1 or TIM1.5, these materials are particularly suited for warped, irregular, or curved surfaces.
“At Indium Corporation, we are committed to advancing thermal interface materials to help our customers overcome the unique challenges of high-power applications,” said Burt. “These novel TIMs address a critical need: improving reliability and efficiency in increasingly complex thermal environments.”
Burt is a Technical Support Engineer at Indium Corporation's global headquarters in Clinton, N.Y. He is responsible for providing technical assistance to optimize the selection and use of Indium Corporation's materials, as well as providing product and process training. Burt earned his bachelor's degree in chemistry from Clarkson University in Potsdam, N.Y. He is also a Certified SMT Process Engineer (CSMTPE).
TestConX 2025 visitors can attend the presentation on Tuesday, March 4, at 1:30 p.m. For more information on Indium Corporation’s TIMs products, visit Burt and additional Indium Corporation experts at booth #45, or visit www.indium.com/TIMs.
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