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Technica USA Expands Partnership with ASMPT to Southern California and Southern Nevada
February 5, 2025 | Technica USAEstimated reading time: 1 minute
Technica USA is pleased to announce the expansion of its long-standing partnership with ASMPT, a global leader in hardware and software solutions for the electronics manufacturing and semiconductor industries. This expansion extends Technica USA’s representation of ASMPT into Southern California and Southern Nevada.
Frank Medina, President and CEO of Technica USA, shared his enthusiasm about the expansion. “We are very pleased to have the opportunity to grow our relationship with ASMPT into these new territories. Over the past 12 years, Technica has built a strong and successful partnership with ASMPT, supporting customers of all sizes and technologies across the Western United States. Customers who have transitioned to ASMPT platforms consistently praise the performance, reliability, and technology of the SIPLACE and DEK product lines, as well as the exceptional support provided through our joint efforts.”
Technica USA currently operates from two locations: its corporate headquarters in San Jose, California, and a Southern California office in Rancho Cucamonga. The San Jose facility houses a Demo & Training Center, originally established in collaboration with ASMPT. Plans are already in motion to develop a similar demo center at the Rancho Cucamonga location.
Medina added, “We look forward to bringing the same level of success we’ve had with the ASMPT product line to customers in Southern California and Southern Nevada.”
Customers in these territories are encouraged to reach out to Jeff Forster for more information via email at jforster@technica.com or through Technica USA’s Corporate Office at (408) 240-5950.
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ASMPT Secures Additional Orders for 15 Chip-to-Substrate TCB Tools Amid AI Demand
12/23/2025 | ASMPTASMPT, the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced it had secured additional orders for 15 Chip-to-Substrate (C2S) Thermo-Compression Bonding (TCB) tools for cutting-edge AI computing chips from a major OSAT partner of a leading foundry, following an earlier order win.
ASMPT Presents Optimized Odd Shaped Component (OSC) Package
12/10/2025 | ASMPTWith the optimized SIPLACE OSC Package, technology and market leader ASMPT SMT Solutions is strengthening the competitiveness of modern electronics manufacturing.
ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market
12/03/2025 | ASMPTASMPT, the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced it had won new orders for 19 Chip-to-Substrate (C2S) TCB tools from a major OSAT partner of the leading foundry serving the AI chip market.
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
09/08/2025 | ASMPTASMPT, the world's leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced the appointment of Mr. Gordon Lam as Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions).
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.