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First Pan-European Electronics Design Conference (PEDC) in Vienna Inspires Participants from 20 Countries

02/06/2025 | IPC
The first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents.

MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics

02/06/2025 | MacDermid Alpha Electronics Solutions
In an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026.

UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2

02/06/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.

Flexible Thinking: Mind-tapping into January

02/05/2025 | Joe Fjelstad -- Column: Flexible Thinking
It’s January again, and our beleaguered planet has completed yet another trip around the sun. The Romans named January in honor of their god Janus, who is usually depicted as a bearded old man with two faces—one looking back to the past and the other looking forward to the future. People venerated Janus as the god of beginnings and endings, transitions, and the passage of time. With that in mind, I’ll look 10 years into the future—hopefully with a bit of inspiration from Janus—and prognosticate what might be happening in electronic design.

Designers Notebook: Addressing Future Challenges for Designers

02/06/2025 | Vern Solberg -- Column: Designer's Notebook
The printed circuit board is and will probably continue to be the base platform for most electronics. With the proliferation of new generations of high I/O, fine-pitch surface mount semiconductor package variations, circuit interconnect is an insignificant factor. Circuit board designers continually face challenges such as component quantity and complexity, limited surface area, and meeting the circuit board’s cost target. The printed circuit design engineer’s prominent position demands the development of efficiently manufacturable products that perform without compromise.
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