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Rehm Thermal Systems Brings Pioneering Manufacturing Technologies to productronica China 2025
February 11, 2025 | Rehm Thermal SystemsEstimated reading time: 3 minutes
![](https://iconnect007.com/application/files/8117/3927/8381/Rehm.jpg)
Since 2002, productronica in China has been one of the most important events in Asia. This year, the trade fair once again offers the opportunity to exchange ideas with international experts, attend specialised lectures, make business contacts and find out about the latest innovations across the entire electronics production value chain. Rehm Thermal Systems will also be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.
In an increasingly competitive environment, electronics manufacturers must continuously adapt and improve their processes to remain competitive: the growing demand for reliable and powerful electronics means that durable and stable solder connections are becoming increasingly important. In addition, production costs are rising significantly due to higher prices for raw materials or electricity, so companies are constantly looking for ways to optimise costs.
Rehm Thermal Systems has responded to these developments and driven forward the further development of systems in areas such as convection soldering, condensation soldering, coating and dispensing: at booth E4.4518, the Rehm experts will be demonstrating the wide range of applications for the dispensing and coating system live at the Protecto. They will also be providing information on convection soldering under vacuum with the VisionXP+ Vac for greater process reliability and on more economical vapour phase soldering with the Condenso Series thanks to the integrated closed-loop system.
High-quality Convection Soldering with the VisionXP+ Vac
Vacuum soldering has proven to be particularly suitable for high-quality solder joints with very few voids: with the VisionXP+ Vac convection soldering system from Rehm Thermal Systems, pores, gas inclusions and voids can be reliably removed directly after the soldering process while the solder is still in an optimally melted state. Time-consuming post-processing of the assemblies using an external vacuum system is therefore no longer necessary. The VisionXP+ Vac is not only characterized by high process stability, but it also impresses with reduced operating costs thanks to the switch to EC motors (energy savings of around 30 percent).
With the closed-loop system for lower production costs thanks to lower Galden® consumption, minimal maintenance and fewer production errors, Rehm Thermal Systems has found a future-proof solution for more economical vapour phase soldering: after soldering, the vacuum and/or cooling process starts. At the same time, the process gas is extracted and purified. A vacuum is created during extraction, which guarantees rapid drying of the solder and process chamber, thus minimising losses when the products are discharged. The extracted Galden® is filtered and cleaned of impurities using granules. This allows approx. 99.9 percent of the medium to be recovered. The purified liquid is stored in a container at room temperature and made available for further processes. This means that no evaporation and energy losses occur. The hermetic sealing of the process chamber (also a vacuum chamber) also prevents evaporation losses during soldering.
Flexible Coating and Dispensing Options with the Protecto Series
Conformal coating has become an integral part of modern manufacturing, as the protective coating is used to reliably protect electronic assemblies from aggressive environmental influences. With the Protecto Series, Rehm Thermal Systems offers you the opportunity to react quickly to market changes and individual customer requirements thanks to a wide range of possible applications: this system is not only used for automated coating, but also for bonding, sealing and fixing. In addition, up to four different materials can be applied directly "on the fly" using the various applicators.
The systems can be operated using the ViCON software, which fulfils all the requirements of modern, networked and, above all, future-oriented electronics production: the ViCON combines tried-and-tested software tools, such as clear product management and process locking, with new possibilities in mobile applications in the form of the ViCON App and ViCON Connect – in an attractive design and with intuitive touch operation.
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