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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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INEMI to Kick Off Webinar on Ecological Footprint Minimization for Sustainable Electronics Roadmap
February 12, 2025 | iNEMIEstimated reading time: Less than a minute
The International Electronics Manufacturing Initiative (INEMI) will host a webinar on February 13, 2025, at 11:00 a.m. EST (5:00 p.m. CST) to initiate the next phase of development for its Sustainable Electronics Roadmap. The webinar will focus on minimizing the ecological footprint of electronics manufacturing through energy-efficient production and responsible water and land management.
The session will begin with a review of previously published roadmap content on circularity and sustainable materials. Following this, participants will engage in online discussions and brainstorming sessions to explore strategies for minimizing the environmental impact of electronics manufacturing across the value chain.
The webinar will feature presentations by:
- Francis Mullany, INEMI Director of Roadmapping
- Thomas Okrasinski, Director of Product Environmental Engineering for Nokia Bell Labs
- Fu Zhao, Professor of Mechanical Engineering and Environmental and Ecological Engineering at Purdue University
Professors Okrasinski and Zhao serve as co-chairs of the INEMI Sustainable Electronics Roadmap.
Registration:
This webinar is open to industry professionals. Advance registration is required.
February 13, 2025
11:00 a.m. — 12:00 p.m. EST (US)
5:00-6:00 p.m. CST (Europe)
Register for this webinar
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