Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Saki Launches Next-Generation 3Si/3Di-EX Series for SPI & AOI
February 12, 2025 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation, a global leader in automated inspection solutions, proudly announces the launch of its latest 3Si/3Di-EX Series of 3D Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, set to begin shipping in April 2025.
3Si/3Di-EX Series - Upgrade to Excellence
Built on Saki's proven high-rigidity gantry structure, the 3Si/3Di-EX Series introduces a modular hardware design that allows seamless optical unit upgrades, ensuring long-term adaptability to evolving inspection needs. With a shared gantry and a unified software interface, this next-generation system offers sustainability, efficiency, and superior usability for high-precision inspection.
Optimized Software & AI-Driven Inspection:
- One Programming: Unified SPI and AOI inspection program data eliminates redundant setup and programming tasks.
- Easy Programming: Simplified and automated program creation minimizes operator workload and enhances productivity.
- AI Assist (*): Reduces false positives through Hybrid AI-powered re-evaluation, improving efficiency and reducing operator workload even further.
- AI OCR (*):AI-powered optical character recognition ensures stable character inspection despite variations in print quality and position, boosts productivity and eliminates the need for specialized skills.
(*: available for the 3Di-EX AOI Series)
Smart Factory Automation for Enhanced Efficiency
The 3Si/3Di-EX Series is engineered to maximize productivity, efficiency and quality control with advanced machine-to-machine (M2M) connectivity and full Smart Factory integration:
- Saki Link: Seamlessly connects SPI and AOI systems, enabling real-time data sharing and optimized inspection flow. Centralized control across multiple inspection systems within a production line eliminates bottlenecks and improves quality control.
These advanced automation capabilities allow manufacturers to streamline processes and achieve greater levels of operational efficiency.
Saki continues to push the boundaries of inspection technology, delivering precision, automation, and sustainability to meet the demands of modern electronics manufacturing. With ‘Made in Japan’ quality and a commitment to customer-driven innovation, the 3Si/3Di-EX Series ensures manufacturers stay ahead in the pursuit of manufacturing excellence.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Arc-Tronics Strengthens Inspection Capabilities with Three New Saki AOI Systems
09/26/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that Arc-Tronics, Inc., a high-reliability EMS provider based in Elk Grove Village, Illinois, has recently installed three 3Di-LS3 Series Automated Optical Inspection (AOI) systems in its production facility.