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Saki Launches Next-Generation 3Si/3Di-EX Series for SPI & AOI
February 12, 2025 | Saki CorporationEstimated reading time: 1 minute

Saki Corporation, a global leader in automated inspection solutions, proudly announces the launch of its latest 3Si/3Di-EX Series of 3D Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, set to begin shipping in April 2025.
3Si/3Di-EX Series - Upgrade to Excellence
Built on Saki's proven high-rigidity gantry structure, the 3Si/3Di-EX Series introduces a modular hardware design that allows seamless optical unit upgrades, ensuring long-term adaptability to evolving inspection needs. With a shared gantry and a unified software interface, this next-generation system offers sustainability, efficiency, and superior usability for high-precision inspection.
Optimized Software & AI-Driven Inspection:
- One Programming: Unified SPI and AOI inspection program data eliminates redundant setup and programming tasks.
- Easy Programming: Simplified and automated program creation minimizes operator workload and enhances productivity.
- AI Assist (*): Reduces false positives through Hybrid AI-powered re-evaluation, improving efficiency and reducing operator workload even further.
- AI OCR (*):AI-powered optical character recognition ensures stable character inspection despite variations in print quality and position, boosts productivity and eliminates the need for specialized skills.
(*: available for the 3Di-EX AOI Series)
Smart Factory Automation for Enhanced Efficiency
The 3Si/3Di-EX Series is engineered to maximize productivity, efficiency and quality control with advanced machine-to-machine (M2M) connectivity and full Smart Factory integration:
- Saki Link: Seamlessly connects SPI and AOI systems, enabling real-time data sharing and optimized inspection flow. Centralized control across multiple inspection systems within a production line eliminates bottlenecks and improves quality control.
These advanced automation capabilities allow manufacturers to streamline processes and achieve greater levels of operational efficiency.
Saki continues to push the boundaries of inspection technology, delivering precision, automation, and sustainability to meet the demands of modern electronics manufacturing. With ‘Made in Japan’ quality and a commitment to customer-driven innovation, the 3Si/3Di-EX Series ensures manufacturers stay ahead in the pursuit of manufacturing excellence.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
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08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
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