Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Saki Launches Next-Generation 3Si/3Di-EX Series for SPI & AOI
February 12, 2025 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation, a global leader in automated inspection solutions, proudly announces the launch of its latest 3Si/3Di-EX Series of 3D Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, set to begin shipping in April 2025.
3Si/3Di-EX Series - Upgrade to Excellence
Built on Saki's proven high-rigidity gantry structure, the 3Si/3Di-EX Series introduces a modular hardware design that allows seamless optical unit upgrades, ensuring long-term adaptability to evolving inspection needs. With a shared gantry and a unified software interface, this next-generation system offers sustainability, efficiency, and superior usability for high-precision inspection.
Optimized Software & AI-Driven Inspection:
- One Programming: Unified SPI and AOI inspection program data eliminates redundant setup and programming tasks.
- Easy Programming: Simplified and automated program creation minimizes operator workload and enhances productivity.
- AI Assist (*): Reduces false positives through Hybrid AI-powered re-evaluation, improving efficiency and reducing operator workload even further.
- AI OCR (*):AI-powered optical character recognition ensures stable character inspection despite variations in print quality and position, boosts productivity and eliminates the need for specialized skills.
(*: available for the 3Di-EX AOI Series)
Smart Factory Automation for Enhanced Efficiency
The 3Si/3Di-EX Series is engineered to maximize productivity, efficiency and quality control with advanced machine-to-machine (M2M) connectivity and full Smart Factory integration:
- Saki Link: Seamlessly connects SPI and AOI systems, enabling real-time data sharing and optimized inspection flow. Centralized control across multiple inspection systems within a production line eliminates bottlenecks and improves quality control.
These advanced automation capabilities allow manufacturers to streamline processes and achieve greater levels of operational efficiency.
Saki continues to push the boundaries of inspection technology, delivering precision, automation, and sustainability to meet the demands of modern electronics manufacturing. With ‘Made in Japan’ quality and a commitment to customer-driven innovation, the 3Si/3Di-EX Series ensures manufacturers stay ahead in the pursuit of manufacturing excellence.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Merlin PCB Group Invests in 2 CIMS Galaxy 25µ AOI Machines
11/13/2025 | Merlin PCB GroupThe Merlin PCB group has invested in CIMS Galaxy 25µ AOI machines, one for Merlin Flex in Hartlepool and the other for Merlin Circuit Technology in Hawarden.
GenI Generative AOI Programming Debuts: Mycronic Sets a New Standard in AOI Automation
11/10/2025 | MycronicMycronic’s PCB Assembly Solution division announces the launch of GenI™, an industry first solution designed to liberate electronics manufacturers from the complexities of traditional Automated Optical Inspection (AOI) programming.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
Koh Young Technology Appoints Jeff Lee as Head of Industrial Solutions Business
11/03/2025 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, has appointed Jeff Lee as Head of Industrial Solutions Business.
UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.