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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Bridging the Gap: Workforce Collaboration in East Texas
February 13, 2025 | Cory Blaylock, IPCEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/5517/0970/6184/cory_blaylock_300.jpg)
IPC has partnered with Stephen F. Austin State University's (SFASU) Center for Applied Research and Rural Innovation (CARRI) and the IPC Education Foundation on a transformative project aimed at aligning academic training with real-world demands in electronics manufacturing. This partnership is not only a significant step forward in workforce development but a shining example of how academia and industry can join forces to create a future-ready workforce. Though this example is focused on PCB assembly, it showcases a valuable model for workforce development in all areas of electronics manufacturing.
The spark igniting this transformation? A powerful blend of strategic funding, hands-on training, and deep industry-academic collaboration.
A select group of SFASU faculty and students underwent intensive certification training last summer for IPC-J-STD-001 and IPC-A-610. These certifications, pivotal for careers in soldering and electronics assembly, equip participants with hands-on skills and technical knowledge that bridge the gap between classroom learning and industry needs. With soldering equipment donated by Weller Tools, SFASU’s faculty and students are now practicing with tools and techniques that meet the standards required in today’s electronics manufacturing workforce.
To read this entire article, which appeared in the January 2025 issue of PCB007 Magazine, click here.
Suggested Items
EIPC 2025 Winter Conference: Business Outlook and New EMS Opportunities
02/18/2025 | Pete Starkey, I-Connect007“Navigating and Optimizing Complex Processes: How to Overcome Today’s and Tomorrow’s Challenges in PCB Processing” was the theme of the 2025 EIPC Winter Conference, held Feb. 4–5, in historic Luxembourg City, the capital of Luxembourg, a small country in the heart of western Europe with borders to Belgium, France, and Germany. EIPC president Alun Morgan welcomed delegates from more than 70 companies in Europe and beyond, and thanked the sponsors of the event. Morgan can always be relied upon for a topical opening presentation. This time, he addressed “Internet of Things: Vulnerabilities and How to Address Them.”
J.A.M.E.S. Explores the Future of Additive Manufactured Electronics
02/18/2025 | Marcy LaRont, I-Connect007Andreas Salomon is chief scientist at J.A.M.E.S, a joint venture of Nano Dimension and HENSOLD. In this interview he discusses the evolving landscape of additively manufactured electronics, highlighting the integration of cutting-edge technologies, such as micro-dispensing and ink jetting. These technologies enhance capabilities in signal integrity and miniaturization. He also talks about the importance of sustainability, the need for standardized testing, and collaboration among industry leaders that will drive innovation and transform the future of electronics manufacturing through IPC’s standards development.
Cambridge GaN Devices Secures $32M to Drive Global Growth in Power Semiconductor Industry
02/18/2025 | BUSINESS WIRECambridge GaN Devices (CGD), a leading innovator in gallium nitride (GaN) power devices, has successfully closed a $32 million Series C funding round. The investment was led by a strategic investor with participation from British Patient Capital and supported by existing investors Parkwalk, BGF, Cambridge Innovation Capital (CIC), Foresight Group, and IQ Capital.
I-Connect007 Welcomes New Milaero Columnist Jesse Vaughan
02/18/2025 | I-Connect007 Editorial TeamI-Connect007 is excited to announce the addition of a new monthly column, “Beyond the Board,” authored by Jesse Vaughan, a seasoned expert in the PCB/milaero sector. Jesse, a third-generation printed circuit board technologist currently working at Summit Interconnect, brings a wealth of knowledge and passion to our publications.
KYZEN to Showcase Stencil Cleaning Research Advancements at IPC APEX EXPO 2025
02/17/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit in Booth 642 at the upcoming 2025 IPC APEX EXPO, scheduled for March 18-20, 2025 at the Anaheim Convention Center. Celebrating 35 years of innovation and continuous improvement, KYZEN will spotlight its industry-leading research and solutions designed to advance electronics manufacturing processes.