BEST Inc. Launches Component Lead Tinning Services
February 14, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component services, is pleased to announce the launch of its new lead tinning services, designed specifically for electronic components. Utilizing advanced robotic hot solder dip technology and adhering to the rigorous standards of GEIA-STD-006B for gold removal, improved solderability, and the ability to convert RoHS compliant components to time-tested tin-lead finishes.
Recognizing the growing demand for high-quality electronic components, BEST Inc. is committed to delivering superior lead-tinning solutions with expedited lead times. Our state-of-the-art equipment allows us to handle a diverse range of through-hole and surface-mount components, making it easier for clients to meet their specific production needs efficiently.
In conjunction with lead tinning, BEST Inc. is proud to offer component salvage services, providing customers with a sustainable option for recovering and reusing legacy and high value components. This not only helps in reducing waste but also supports the environment by extending the life cycle of essential electronic parts.
"Our new lead tinning services underscores our dedication to quality while promoting sustainability in the electronics industry," said Grant Zellmer, Operations Manager at BEST Inc. "By combining advanced technology with efficient service, we strive to meet the evolving needs of our customers while contributing positively to the environment."
BEST Inc. invites businesses in need of reliable lead tinning and component salvage services to contact us for inquiries or to discuss specific project requirements. Our experienced team is ready to assist customers in enhancing their electronic component quality and sustainability initiatives.
Suggested Items
Saab’s CEO Micael Johansson elected President of ASD
05/26/2025 | SaabThe Aerospace, Security and Defence Industries Association of Europe (ASD), has elected Saab CEO Micael Johansson as its new President and Chairman of the Board.
Robert C. Donovan Joins DISTRON, Marking the Third Generation in Family Leadership
05/26/2025 | Distron Corp.DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, proudly announces that Robert C. Donovan, son of CEO Robert H. Donovan and grandson of Founder Robert G. Donovan, has joined the company as a Management Trainee. This milestone marks the beginning of the third generation of family leadership at the company.
Celebrating Leadership, Legacy and the Future of Southeast Asia’s Semiconductor Industry
05/26/2025 | SEMIOn the occasion of its 30th anniversary, SEMICON Southeast Asia (SEA) 2025 hosted the Night of Leaders, a dinner and awards ceremony that honoured individuals shaping the region’s semiconductor future.
Explore TRI’s Test and Inspection Solutions at SMTA Ontario Expo 2025
05/23/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join the SMTA Ontario Expo 2025.
Qualcomm, Xiaomi Expand Collaboration with Multi-Year Agreement
05/23/2025 | Qualcomm Technologies, Inc.Qualcomm Technologies, Inc. and Xiaomi Corporation are celebrating 15 years of collaboration and have executed a multi-year agreement.