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BEST Inc. Launches Component Lead Tinning Services
February 14, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component services, is pleased to announce the launch of its new lead tinning services, designed specifically for electronic components. Utilizing advanced robotic hot solder dip technology and adhering to the rigorous standards of GEIA-STD-006B for gold removal, improved solderability, and the ability to convert RoHS compliant components to time-tested tin-lead finishes.
Recognizing the growing demand for high-quality electronic components, BEST Inc. is committed to delivering superior lead-tinning solutions with expedited lead times. Our state-of-the-art equipment allows us to handle a diverse range of through-hole and surface-mount components, making it easier for clients to meet their specific production needs efficiently.
In conjunction with lead tinning, BEST Inc. is proud to offer component salvage services, providing customers with a sustainable option for recovering and reusing legacy and high value components. This not only helps in reducing waste but also supports the environment by extending the life cycle of essential electronic parts.
"Our new lead tinning services underscores our dedication to quality while promoting sustainability in the electronics industry," said Grant Zellmer, Operations Manager at BEST Inc. "By combining advanced technology with efficient service, we strive to meet the evolving needs of our customers while contributing positively to the environment."
BEST Inc. invites businesses in need of reliable lead tinning and component salvage services to contact us for inquiries or to discuss specific project requirements. Our experienced team is ready to assist customers in enhancing their electronic component quality and sustainability initiatives.
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Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
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Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.