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BEST Inc. Launches Component Lead Tinning Services
February 14, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component services, is pleased to announce the launch of its new lead tinning services, designed specifically for electronic components. Utilizing advanced robotic hot solder dip technology and adhering to the rigorous standards of GEIA-STD-006B for gold removal, improved solderability, and the ability to convert RoHS compliant components to time-tested tin-lead finishes.
Recognizing the growing demand for high-quality electronic components, BEST Inc. is committed to delivering superior lead-tinning solutions with expedited lead times. Our state-of-the-art equipment allows us to handle a diverse range of through-hole and surface-mount components, making it easier for clients to meet their specific production needs efficiently.
In conjunction with lead tinning, BEST Inc. is proud to offer component salvage services, providing customers with a sustainable option for recovering and reusing legacy and high value components. This not only helps in reducing waste but also supports the environment by extending the life cycle of essential electronic parts.
"Our new lead tinning services underscores our dedication to quality while promoting sustainability in the electronics industry," said Grant Zellmer, Operations Manager at BEST Inc. "By combining advanced technology with efficient service, we strive to meet the evolving needs of our customers while contributing positively to the environment."
BEST Inc. invites businesses in need of reliable lead tinning and component salvage services to contact us for inquiries or to discuss specific project requirements. Our experienced team is ready to assist customers in enhancing their electronic component quality and sustainability initiatives.
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Julia McCaffrey - NCAB GroupSuggested Items
Hardware Engineers, Manufacturing Leaders Ready to ‘Build Better’ Electronics
10/06/2025 | Marcy LaRont, I-Connect007According to Instrumental’s dynamic CEO, Anna-Katrina Shedletsky, the Build Better Electronics Manufacturing Summit on Sept. 30 was a passion project meant to provide a forum for hardware engineering senior leadership, who have very busy jobs and limited opportunities, to share information, thought leadership, and networking opportunities. “Build Better is really about cross-pollination and sharing,” she said, as she highlighted the importance of supporting this type of sharing in tech, which may be more important than ever before.
Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
09/18/2025 | Dan Beaulieu -- Column: Dan's Biz BookshelfDan Beaulieu continues his popular book review series by reviewing four classic books that he believes everyone should have on their bookshelf. In this column, he reviews "The Prince" by Niccolò Machiavelli, "The Art of War," by Sun Tzu, "How to Win Friends and Influence People," by Dale Carnegie, and "Think and Grow Rich," by Napoleon Hill. While we've all heard of these books and maybe read them, Dan will give you a new perspective.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.