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A Fresh Perspective: Checking in With IPC Student Board Member Waad Tarman
February 17, 2025 | Charlene Gunter du Plessis, IPC Education FoundationEstimated reading time: 1 minute

Waad Tarman is the current IPC Student Board Member and incoming president of the IPC Student Chapter at Auburn University. She has an impressive background as a second-year Ph.D. student and dedicated research assistant at Auburn University’s Electronics Manufacturing and Reliability Laboratory within the Industrial and Systems Engineering Department.
As a Student Board Member, Waad has full voting rights and attends all Board meetings. Her role is focused on bringing a fresh perspective to the table, based on students’ needs and aspirations, as a representative of her fellow IPC student members. Her journey has been defined by a determined pursuit of leadership and a passion for making a positive impact. She possesses strong knowledge of various microelectronics manufacturing, including PCB fabrication and assembly (PCBA), package mounting and assembling (SMT and THMT) technologies, inspection and quality control, and design for manufacturing (DFM).
I visited with Waad last fall after she returned from attending an IPC Board meeting in Munich.
What does it mean to you to serve on the IPC Board of Directors?
Waad Tarman: It is an incredible honor and responsibility to serve on the IPC Board of Directors as the student member. Being the voice of students means ensuring that, in a field that is always changing, our needs and goals are considered. It’s also a unique opportunity to witness how decisions are made at the highest levels of leadership in electronics manufacturing. I have developed a deep understanding for the breadth of knowledge and teamwork needed to overcome industry concerns, and I feel privileged to contribute to these discussions from a student perspective.
Continue reading this article in the Winter 2025 issue of IPC Community.
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New Course Presents a Comprehensive Guide to IPC Standards
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North American EMS Industry Shipments Down 1.4% in August
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10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.
Winners of Hand Soldering and Wire Harness Competitions Announced at NEPCON Vietnam 2025
09/24/2025 | Global Electronics AssociationIn conjunction with NEPCON Vietnam 2025, the Global Electronics Association hosted its popular Hand Soldering Competition on September 11–12, 2025, and the Northen regional round of the Wire Harness Competition on September 10, 2025, in Hanoi, Vietnam.