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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Benmayor to Exhibit Technosystem Automation at IPC APEX EXPO 2025
February 17, 2025 | BenmayorEstimated reading time: 1 minute
Benmayor is excited to announce its participation in IPC APEX EXPO 2025, a premier global trade show and technical conference for the electronics manufacturing industry. The event will take place at the Anaheim Convention Center in Anaheim, California, from March 18-20, and we invite attendees to visit us at Booth 4522 to explore the latest Technosystem Automation solutions.
Cutting-Edge Automation for the PCB Industry
Technosystem will showcase its latest innovations in PCB automation, including:
The V3-AOI DUO (Double Rack) Loader & Unloader - A key highlight at the show will be the automation of the Galaxy AOI machine from CIMS. The Technosystem V3 AOI is capable of automating all standalone AOI, LDI, DI, and Legend Printers available on the market. It features a fully integrated protocol, allowing job queue management and real-time adjustments without production downtime. Additionally, all Technosystem automation solutions are Industry 4.0-ready, ensuring seamless integration into modern smart factories.
The Millennium V4 Loader & Unloader with Laser Engraving, Copper thickness and dielectric thickness – This equipment is capbale of measuring copper thickness, dielectric thickness and laser engraving a unique serial number or QR code used to drive automation in process
These automation solutions are specifically designed for mid-sized PCB manufacturers handling high-mix, high-layer count production, where precision and delicate handling are essential.
Seamless Integration with Leading PCB Equipment
Meet Us at IPC APEX EXPO 2025
We welcome you to visit Booth 4522 at Technosystem Automation from Benmayor, where our team will be available to discuss how our solutions can optimize your PCB manufacturing process.
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Simon Khesin - Schmoll MaschinenSuggested Items
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
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ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
Regional Electronics Growth and Initiatives with Gaurab Majumdar
04/14/2026 | Real Time with... APEX EXPONolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.
Boeing Delivers ViaSat-3 Flight 3 Spacecraft to Viasat
04/13/2026 | BoeingBoeing announced, delivery of the ViaSat-3 Flight 3 (VS-3 F3) spacecraft to Viasat. Built on Boeing’s high-power 702MP+ platform and integrated at Boeing’s El Segundo facility in California.