-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Benmayor to Exhibit Technosystem Automation at IPC APEX EXPO 2025
February 17, 2025 | BenmayorEstimated reading time: 1 minute
Benmayor is excited to announce its participation in IPC APEX EXPO 2025, a premier global trade show and technical conference for the electronics manufacturing industry. The event will take place at the Anaheim Convention Center in Anaheim, California, from March 18-20, and we invite attendees to visit us at Booth 4522 to explore the latest Technosystem Automation solutions.
Cutting-Edge Automation for the PCB Industry
Technosystem will showcase its latest innovations in PCB automation, including:
The V3-AOI DUO (Double Rack) Loader & Unloader - A key highlight at the show will be the automation of the Galaxy AOI machine from CIMS. The Technosystem V3 AOI is capable of automating all standalone AOI, LDI, DI, and Legend Printers available on the market. It features a fully integrated protocol, allowing job queue management and real-time adjustments without production downtime. Additionally, all Technosystem automation solutions are Industry 4.0-ready, ensuring seamless integration into modern smart factories.
The Millennium V4 Loader & Unloader with Laser Engraving, Copper thickness and dielectric thickness – This equipment is capbale of measuring copper thickness, dielectric thickness and laser engraving a unique serial number or QR code used to drive automation in process
These automation solutions are specifically designed for mid-sized PCB manufacturers handling high-mix, high-layer count production, where precision and delicate handling are essential.
Seamless Integration with Leading PCB Equipment
Meet Us at IPC APEX EXPO 2025
We welcome you to visit Booth 4522 at Technosystem Automation from Benmayor, where our team will be available to discuss how our solutions can optimize your PCB manufacturing process.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.