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Siemens Delivers Certified and Automated Design Flows for TSMC 3DFabric Technologies
February 17, 2025 | SiemensEstimated reading time: 1 minute
Siemens Digital Industries Software announced, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using Siemens industry-leading advanced packaging integration solutions.
“Siemens is pleased that our continued collaboration with TSMC has delivered a certified Xpedition Package Designer automated workflow driven by Innovator3D IC that provide customers with an expanding number of design avenues, even as time and design complexity pressures continue to rise,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “The combination of Siemens’ industry-leading Innovator3D IC driven semiconductor packaging solutions and TSMC’s leading-edge 3DFabric advanced packaging platforms such as InFO enable our many mutual customers to achieve truly remarkable and industry-disrupting innovations.”
Siemens’ automated design workflows for TSMC’s InFO_oS and InFO_PoP technologies are driven by the heterogeneous integration cockpit capabilities of the Innovator3D IC™ solution and includes Xpedition™ Package Designer software, HyperLynx™ DRC, and Calibre® nmDRC software technologies, which are all industry leaders in semiconductor package design.
“Siemens has been a longstanding partner of TSMC, consistently increasing its value to the TSMC Open Innovation Platform® (OIP) ecosystem by offering high-quality solutions that support next-generation semiconductor designs using TSMC’s leading-edge advanced process and packaging technologies,” said Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC. “We look forward to further strengthening our collaboration with OIP ecosystem partners like Siemens, enabling our customers to bring innovative semiconductor designs to future AI, HPC, and mobile applications.”
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Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | SiemensSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..
Siemens Collaborates with TSMC to Accelerate 3D IC and AI-driven Circuit and Systems Design
09/24/2025 | SiemensAt the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and innovative design solutions enablement initiatives for the foundry’s newest and most advanced process technologies.
Siemens Launches Lighthouse Project of Made for Germany Initiative
09/23/2025 | SiemensIn the presence of political leaders and representatives of the business community, Siemens today laid the cornerstone for the new Siemens Technology Campus in Erlangen, Germany. A lighthouse project of the Made for Germany initiative, the Technology Campus will further strengthen the economic viability of Germany and the region primarily in the area of power electronics.
Siemens Accelerates Complex Semiconductor Design and Test with Tessent IJTAG Pro
09/22/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced Tessent™ IJTAG Pro software, which will transform IJTAG (IEEE 1687) input/output by enabling parallel operations of the traditionally serial operation and provide read and write access to custom hardware.
Siemens, TRUMPF Partner to Accelerate Digital Manufacturing and AI Readiness
09/16/2025 | SiemensTechnology company Siemens and leading machine tools and laser manufacturer TRUMPF announced a partnership that promises to elevate industrial production by harnessing advanced digital manufacturing solutions.