-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
I-Connect007 Welcomes New Milaero Columnist Jesse Vaughan
February 18, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

I-Connect007 is excited to announce the addition of a new monthly column, “Beyond the Board,” authored by Jesse Vaughan, a seasoned expert in the PCB/milaero sector.
Jesse, a third-generation printed circuit board technologist currently working at Summit Interconnect, brings a wealth of knowledge and passion to our publications.
His new column, “Beyond the Board,” will delve into market and industry trends, workforce engagement, and the processes and technology roadmap within the electronics industry. He will explore a variety of topics, including the future of innovation, electronics and sustainability, how electronics careers are changing the world, breaking stereotypes, and other market trends.
Jesse Vaughan is a third-generation PCB technologist with extensive experience in PCB design, fabrication, assembly, and program management. He has collaborated closely with engineers, manufacturers, and supply chains to deliver high-quality, reliable solutions. Jesse excels at bridging the gap between innovation and manufacturability, optimizing complex board designs, and streamlining production processes. His commitment to advancing PCB technology is evident through his active participation in several IPC committees.
He is currently employed as a senior account manager at Summit Interconnect.
We look forward to Jesse’s insightful contributions and are confident that “Beyond the Board” will become a valuable resource. The first column debuts in the I-Connect007 newsletter MilAero007 Week on Tuesday, Feb. 25.
Suggested Items
TRI Unveils New Platform for Diverse Board Sizes
07/14/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.
IBIDEN Selected for Multiple MSCI ESG Indexes for 2025
07/14/2025 | IBIDENIBIDEN Co, Ltd. is pleased to announce that it has been selected for inclusion in MSCI Inc.'s MSCI Selection Indexes (formerly the MSCI ESG Leaders Indexes), MSCI Japan ESG Select Leaders Index, and MSCI Nihonkabu ESG Select Leaders Index.
Rogers Corporation Announces CEO Transition
07/14/2025 | Rogers CorporationThe Board of Directors of Rogers Corporation announced that Colin Gouveia has left his position as President and CEO and has resigned from the Board on July 12, 2025.
Maybank Becomes First Southeast Asian Bank to Grant Sustainability-Linked Loan to Austria’s AT&S
07/14/2025 | AT&SMaybank announced it is granting a Sustainability-Linked Loan (SLL) amounting to USD150 million to Austria Technologie & Systemtechnik Malaysia (AT&S Malaysia).
New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.