-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
PARMI USA to Unveil Xceed II AOI System at IPC APEX EXPO 2025
February 18, 2025 | PARMI USAEstimated reading time: 1 minute

PARMI USA, INC., a leader in advanced 3D inspection systems, is excited to announce the launch of its next-generation 3D Automated Optical Inspection (AOI) system, the Xceed II, at the 2025 IPC APEX EXPO, scheduled to take place March 18-20, 2025 at the Anaheim Convention Center in Anaheim, California. The Xceed II will be featured at Booth 910, where PARMI will showcase its latest advancements in inspection technology.
The Xceed II features an enhanced platform designed to improve inspection speed and quality. This new system incorporates the TRSC-II sensor, delivering superior 2D/3D data quality and offering five different resolution settings, from high precision (4 µm, 6 µm, 7 µm) for detailed inspection to high-speed settings (10 µm, 14 µm) for faster throughput.
A key highlight of the Xceed II is its optimization for die inspection, including System in Package (SiP), bare die, IPD, die attach, underfill fillet, and Cu Clip on die. This makes it the ideal solution for inspecting complex components found in next-generation electronics. Additionally, the system enhances 2D die inspection through advanced coaxial lighting, enabling more types of defect detection on the die’s top surface, including text, polarity, cracks, contamination, chipping, and epoxy issues.
“We are excited to showcase the Xceed II at IPC APEX EXPO 2025,” said Juan Arango, Head of Sales and Business Development at PARMI USA. “The improvements in speed, precision, and die inspection optimization make the Xceed II the most advanced AOI system for today’s high-demand, high-precision manufacturing environments.”
Visit PARMI USA at Booth 910
PARMI USA invites industry professionals to experience the Xceed II firsthand at Booth 910 during the upcoming IPC APEX EXPO. Attendees will have the opportunity to explore how the Xceed II can enhance inspection efficiency, reduce defects, and improve production processes.
Visit PARMI at IPC APEX EXPO 2025
Attendees at IPC APEX EXPO 2025 are invited to Booth 910 to learn more about the Xceed II and explore how PARMI's inspection solutions can transform their manufacturing processes.
Suggested Items
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
Zhen Ding Releases April 2025 Monthly Revenue Report
05/07/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported April 2025 revenue of NT$13,589 million, up 22.90% YoY, marking a record high for the same period in the company’s history.
Schweizer Electronic AG: Business Development in Q1 of 2025
05/07/2025 | Schweizer Electronic AGThe Schweizer Group continued its growth trajectory in the first quarter of 2025. Revenue reached EUR 39.4 million in the first quarter of 2025, up 14.9% on the previous quarter (Q4 2024: EUR 34.4 million) and slightly above the level of the same quarter of the previous year (Q1 2024: EUR 39.2 million).
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
Global Semiconductor Sales Increase 18.8% in Q1 2025 Compared to Q1 2024; March 2025 Sales up 1.8% MoM
05/06/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $167.7 billion for the first quarter of 2025, an increase of 18.8% compared to the first quarter of 2024 but 2.8% less than the fourth quarter of 2024.