Beyond Design: The Metamorphosis of the PCB Router
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
Elementary, Mr. Watson: PCB Routing: The Art—and Science—of Connection
AIM to Highlight REL61™, W20, and Ultrafine Paste Offerings at Productronica China
February 19, 2025 | AIMEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Productronica China, taking place March 26-28 at the Shanghai New International Expo Center. Among other great products, AIM will showcase its latest innovations in soldering technology, including REL61™, W20 water-soluble solder paste, and ultrafine solder paste solutions.
AIM’s REL61™ alloy, a low-cost SAC305 alternative, provides superior performance across most metrics including thermal fatigue. REL61 is lead-free and versatile – available in bar, wire, and paste.
W20 is a halogen-free, water-soluble solder paste, engineered for excellent printability, cleanability, and reduced voiding. AIM will also highlight its ultrafine solder paste solutions, designed to meet the increasing demand for miniaturization in advanced electronics manufacturing.
Share on:
Suggested Items
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.