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Advance Chip & Circuit Materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.
“Availability of Celeritas in Speedstack eases the specification of ACCM materials for the OEM design community. PCB Technologists often mandate specific materials for demanding high-speed and high-density applications,” said Michael Gay, VP of marketing at ACCM.
This partnership:
- Allows simplified production of build-up technologies with Celeritas
- Provides an on-line and on premise material library from ACCM in Speedstack
- Opens new opportunities to extend the use of UHDI
Speedstack is in widespread use with OEMs who specify PCB stackups for specific applications, and eases the communication of stackup information throughout the PCB supply chain as PCB fabricators across the world are familiar with Speedstack’s clear and concise documentation and the availability of stackup data in XML format which can be imported into multiple production systems at the time of fabrication.
