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ACCM Joins Polar’s Speedstack Material Partner Program
June 10, 2025 | Polar InstrumentsEstimated reading time: Less than a minute
Advance Chip & Circuit materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.
“Availability of Celeritas in Speedstack eases the specification of ACCM materials for the OEM design community. PCB Technologists often mandate specific materials for demanding high speed and high density applications,” remarks Michael Gay, VP of marketing at ACCM.
This partnership:
- Allows simplified production of build-up technologies with Celeritas
- Provides an on-line and on premise material library from ACCM in Speedstack
- Opens new opportunities to extend the use of UHDI
Speedstack is in widespread use with OEMs who specify PCB stackups for specific applications, and eases the communication of stackup information throughout the PCB supply chain as PCB fabricators across the world are familiar with Speedstack’s clear and concise documentation and the availability of stackup data in XML format which can be imported into multiple production systems at the time of fabrication.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
All Flex Solutions Upgrades Lamination Layup
06/19/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
'Air Sovereignty' for AT&S: Gold Status Underpins Highest Aerospace Competence in Leoben
06/19/2025 | AT&SThe systems that control modern aircraft are subject to the strictest requirements in the electronics industry. Suppliers to aviation companies must therefore have their production facilities and processes inspected annually by independent auditors as part of the National Aerospace and Defense Contractors Accreditation Program (Nadcap).
Felix Martinez Promoted to Insulectro VP of Operations
06/19/2025 | InsulectroInsulectro is pleased to announce the internal promotion of Felix Martinez to Vice President of Operations.
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.