Mycronic to Showcase its Full-line Solution at IPC APEX EXPO 2025

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Mycronic, the leading Sweden-based electronics assembly solutions provider, continues to respond to growing customer demand by offering high-flexibility and high-productivity solutions.

At IPC APEX EXPO 2025, Mycronic will showcase its full-line solution designed to empower manufacturers with greater efficiency, precision, and automation, from next-generation pick-and-place solutions to AI-powered defect classification and automated material handling.

With high flexibility, customers can reimagine the possibilities with a full-line offering. For example, our multi-machine programming tool MYPro Create is the next level for a unified programming solution. This software streamlines job creation across multiple systems for Jet Printer, SPI, and AOI – using a single data input, thereby enhancing productivity and consistency. And that is not all, here is what else will be showcased:

MYPro A40 models: deliver bigger volumes

The MYPro A40™ delivers the high accuracy and fast changeovers you expect from the icon of agility, together with a dramatic increase in throughput speed. 

Key benefits in the A40 models include:

• Equipped with MX7 mounthead technology
• Top speeds between the three models range from 18,000-59,000 CPH
• All-new intuitive user interface
• Low-maintenance modular design
• Up to 224 Agilis feeder positions per machine

When looking for bigger volumes and bigger opportunities, the MYPro A40DX pick-and-place model includes two MX7 high-speed mountheads and one MIDAS high-precision mounthead. This model can boost output by 48% higher speeds in comparison to previous models allowing for flexibility turbocharged.

MYPro S30: precision printing for maximum yield

The Mycronic MYPro S30 stencil printer will showcase high-speed, precision printing for SMT assembly, ensuring superior quality and efficiency. With advanced automation, intuitive software, and quick changeovers, it minimizes downtime and maximizes throughput. Designed for reliability and flexibility, it adapts to diverse production needs, making it the ideal solution for manufacturers seeking consistent, high-quality solder paste applications.

DeepReview: AI-driven defect classification

Accelerating review times and reducing false calls, Mycronic’s DeepReview for 3D AOI solution enhances PCB assembly by automatically improving defect classification models over time. DeepReview, a new AI-based Automatic Defect Classification system for 3D AOI, allows full test coverage of any product without fear of false calls.

“When we talk about time savings and meeting customer expectations to stay competitive and profitable, we offer a new level of flexibility, accuracy, and advanced automation,” says Clemens Jargon, Sr. VP High Flex.

MYTower: automated material handling for increased efficiency

MYTower provides automated, intelligent, and safe storage of electronic components. To ensure that production lines are always running smoothly and efficiently, automation of material handling is important – especially in high-mix environments where job changeovers are frequent or in volume production replenishing components in a timely manner to ensure high equipment utilization.

Visit Mycronic at IPC APEX EXPO 2025 in Anaheim, CA, U.S., March 18-20 at booth #1842 to experience these groundbreaking solutions firsthand and discover how Mycronic is shaping the future of electronics assembly.