KYZEN to Showcase MICRONOX MX2123 Power Module Cleaner at IMAPS Device Packaging Conference 2025

Estimated reading time: 1 minute

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on Device Packaging scheduled to take place March 3-6 at the Sheraton Grand at Wild Horse Pass in Phoenix, AZ. The KYZEN clean team will be on-site at Booth #705 providing information about multi-process power module cleaner MICRONOX MX2123 during the event.

With the continued rise in demand for high-performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.

MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.

The IMAPS Device Packaging Conference is an annual, international event celebrating its 21st year serving as a forum for the exchanging of knowledge while providing technical, social and networking opportunities for leading scientists, process engineers, product engineers, manufacturing engineers, academia and business managers in addition to sales and marketing professionals.