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Bittele Electronics Launched its PCB Assembly Capabilities in Malaysia
February 21, 2025 | Bittele ElectronicsEstimated reading time: Less than a minute
Continuing the expansion of its global footprint, Bittele Electronics brought on line the newest addition to its global production capacity: three assembly lines located in Malaysia.
Consistent with its policy of remaining competitive in face of changing global trade conditions, Bittele is proud to now be able to offer US Clients specifically, a manufacturing option unaffected by tariffs recently announced on goods and services originating from Canada and China.
Bittele boards assembled in Malaysia follow the same strict quality standards our clients are accustomed to, and cater to the same client needs - from prototypes to low and mid-volume production. They are subject to the same quality control procedures and oversight that Bittele clients have come to expect - from Automated Optical Inspection (AOI) to X-ray inspection for BGA and QFN components, to functional testing, and in-circuit testing (ICT).
"We are excited to announce to our valued client base that we just expanded our global presence to Malaysia. This move allows us to better serve our US clients with high-quality PCB assembly solutions while remaining price-competitive in spite of tariffs," said Ben Yang, CEO of Bittele Electronics.
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Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
Building PCBs and Policy in Europe: Group ACB Champions Advocacy, Standards Development, and Technical Leadership
10/30/2025 | Linda Stepanich, Community MagazineHow does a European PCB manufacturer navigate the competitive manufacturing landscape in Europe? By participating in standards development committee meetings, testifying before the European Commission on industry issues, and sponsoring hand-soldering competitions in the region. Group ACB, based in France and Belgium, focuses on high-reliability applications. The 37-year-old company is also active in the Global Electronics Association, giving credit for helping ACB to raise awareness of electronics manufacturing in Europe.
GlobalFoundries Announces Chief Financial Officer Transition
10/28/2025 | GlobalFoundriesGlobalFoundries (GF) announced that, effectively immediately, John Hollister, GF’s Chief Financial Officer, is leaving the company for personal reasons. Sam Franklin, GF’s Senior Vice President of Business Finance, Operations and Investor Relations, will assume the position of Interim Chief Financial Officer while the company conducts a search for a permanent CFO.