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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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2024 Sustainability Highlights: IPC’s Commitment to a Greener Future
February 25, 2025 | Kelly Scanlon, IPCEstimated reading time: Less than a minute

In 2024, IPC’s Sustainability for Electronics program made significant impacts through multiple channels of engagement by providing the industry with insights and tools needed to build electronics better. IPC representatives shared expertise at industry events, demonstrating how standards, education, and advocacy support sustainability goals. Industry leaders reciprocated by presenting their successful sustainability initiatives at IPC events, offering valuable real-world perspectives on implementing sustainable practices.
Responding to calls for industry alignment, we formed strategic partnerships with other electronics associations to consolidate and distribute sustainability resources across our extensive industry network. Our efforts focused on harmonizing approaches and maximizing impact through collaborative action. We played a crucial role in highlighting critical industry challenges, including emerging global plastics policies, new due diligence requirements, circular design innovations, and sustainable chemical alternatives. A key achievement was the publication of our white paper on double materiality assessments (DMAs), which addresses new due diligence laws (more on this below).
To read this entire article, which appeared in the February 2025 issue of PCB007 Magazine, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
Teramount Raises $50M to Address Growing Demand for AI Infrastructure Optical Connectivity
07/31/2025 | PRNewswireTeramount, the leader in scalable fiber-to-chip interconnect solutions for AI, data centers and advanced computing, today announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
From Attraction to Action: Where Marketing Ends and Sales Begins
07/29/2025 | Brittany Martin, I-Connect007Before a PO hits the system, marketing has already done a lot of heavy lifting. Without strategic marketing, the PO might never arrive. At I-Connect007, we have been fortunate to help many companies achieve sales success through marketing. The key to success? Understanding how marketing leads to sales.
American Made Advocacy: A Growing Presence in Washington in Turbulent Times
07/29/2025 | Shane Whiteside -- Column: American Made AdvocacyLast month, PCBAA held its fourth annual meeting in Washington, D.C. It was our largest gathering to date and included speakers from the House and Senate, the Department of Commerce, and OEMs Lockheed Martin, RTX, and Northrop Grumman. We also spent a day on Capitol Hill educating lawmakers and their staff about the importance of a secure domestic microelectronics supply chain.
TSMC’s Dr. C.C. Wei and Dr. Mark Liu to Receive SIA’s Highest Honor
07/28/2025 | SIAThe Semiconductor Industry Association (SIA) announced Dr. C.C. Wei, TSMC’s Chairman and CEO, and Dr. Mark Liu, TSMC’s Former Chairman and Former President & Co-CEO, have been selected as the 2025 co-recipients of our industry’s highest honor, the Robert N. Noyce Award.