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Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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2024 Sustainability Highlights: IPC’s Commitment to a Greener Future
February 25, 2025 | Kelly Scanlon, IPCEstimated reading time: Less than a minute

In 2024, IPC’s Sustainability for Electronics program made significant impacts through multiple channels of engagement by providing the industry with insights and tools needed to build electronics better. IPC representatives shared expertise at industry events, demonstrating how standards, education, and advocacy support sustainability goals. Industry leaders reciprocated by presenting their successful sustainability initiatives at IPC events, offering valuable real-world perspectives on implementing sustainable practices.
Responding to calls for industry alignment, we formed strategic partnerships with other electronics associations to consolidate and distribute sustainability resources across our extensive industry network. Our efforts focused on harmonizing approaches and maximizing impact through collaborative action. We played a crucial role in highlighting critical industry challenges, including emerging global plastics policies, new due diligence requirements, circular design innovations, and sustainable chemical alternatives. A key achievement was the publication of our white paper on double materiality assessments (DMAs), which addresses new due diligence laws (more on this below).
To read this entire article, which appeared in the February 2025 issue of PCB007 Magazine, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Nolan’s Notes: Everyone Has Their Eye on India
09/03/2025 | Nolan Johnson -- Column: Nolan's NotesIn this issue of SMT007 Magazine, we turn our attention to the Indian EMS market. We start with an interview with David Bergman, whose foresight in the early 2000s opened doors for the Global Electronics Association to begin helping Indian EMS companies with standards and certifications that would give EMS companies a footing to enter a global EMS market.