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More than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May 27-30, 2025 at the Gaylord Texan Resort & Convention Center here. ECTC is the premier international event bringing together the best in packaging, components, and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange. There are only a few rooms left at the conference rate so reservations should be made as soon as possible.
The flagship conference of the IEEE Electronics Packaging Society, ECTC 2025 offers a finalized technical program of some 400 technical papers in 36 oral and five interactive sessions, one of which is a student session; 12 special sessions on selected topics; a range of professional development opportunities; 135+ exhibits showcasing industry-leading product and service companies from around the world; and various social events and student outreach activities to facilitate networking.
The range of topics to be covered at ECTC 2025 encompasses heterogeneous integration, photonics, components, materials, assembly, reliability, modeling, interconnect design and technology, 2.5D/3D/3.5D integration technologies, direct/hybrid bonding, device/system packaging, wafer-level packaging, optoelectronics and more.
“Packaging has become critically important in the semiconductor industry, because the benefits to be gained from heterogeneous integration and advanced packaging techniques are rivaling and surpassing those which can be obtained by the traditional approach of making chips faster according to Moore’s Law,” said Przemyslaw Gromala, ECTC 2025 Program Chair and Sr. Expert/Simulation Team Leader at Robert Bosch GmbH. “ECTC is the premier industry forum where these technologies are unveiled and discussed. The growing worldwide interest in them is evident in the results from last year’s ECTC conference, which had record attendance, a record number of paper submissions and presentations, record international participation, and a sold-out exhibition hall.”
