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U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to $165B
March 5, 2025 | TrendForceEstimated reading time: 1 minute
TrendForce’s latest findings reveal that TSMC has announced it’s increasing investment in U.S. advanced semiconductor manufacturing, bringing the total to US$165 billion. Mass production is expected to begin after 2030 if the three newly planned fabs proceed on schedule. The U.S., which has been actively expanding its advanced semiconductor capacity, is projected to hold 22% of the global market share by 2030.
TrendForce notes that TSMC first announced plans for its Arizona fab in 2020 as part of a six-fab expansion strategy, aiming to mitigate geopolitical risks. However, escalating trade tensions and tariff issues have forced the company to accelerate its expansion timeline.
Since 2018, global trade conflicts and the COVID-19 pandemic have accelerated supply chain fragmentation, with governments worldwide striving to establish localized semiconductor production. TrendForce data from 2021 indicates that Taiwan accounted for 71% of global advanced node capacity and 53% of mature node capacity. However, by 2030, Taiwan’s advanced process share is expected to decline to 58%, while its mature process share will drop to 30% as the U.S. and China ramp up their semiconductor manufacturing capabilities.
Expanding U.S. investments is a strategic necessity as U.S.-based clients represent the largest share of TSMC’s advanced node adoption. TSMC is also establishing two advanced packaging plants and a R&D center for HPC applications in addition to three new fabs. Arizona is set to become TSMC’s leading overseas technology hub, ensuring comprehensive service for key clients.
While expanding U.S. production reduces concentration risks, it could also lead to higher costs for U.S. IC customers. These increased expenses may trickle down to higher component and end-product prices, potentially affecting consumer purchasing behavior.
TrendForce observes that TSMC’s Arizona Phase 1 has just entered mass production, while Phase 2 and Phase 3 are still under construction, with mass production expected between 2026 and 2028. The actual timeline for the newly announced fabs remains uncertain, with no immediate impact on the industry in the short term. However, in the mid-to-long term, the cost implications and potential price increases across the supply chain will be key factors to watch.
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Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
10/27/2025 | I-Connect007 Editorial TeamNvidia has begun production of its next-generation Blackwell GPUs in the United States, but the company still depends heavily on Taiwan to complete the process, The Register reported.
TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
10/27/2025 | I-Connect007 Editorial TeamTSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.