Imagine the Possibilities: Tech Conference 2025
March 5, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 1 minute
As we approach the 25th anniversary of IPC APEX EXPO, excitement buzzes around the annual Technical Program. Coming off a tremendously successful program in 2024—co-hosted with ECWC16 and with a significant global presence—organizers wanted to match that same level of engagement. In this interview, Stan Rak of SF Rak Company and Udo Welzel of Robert Bosch Mobility Electronics, co-chairs of the Technical Program Committee (TPC), highlight efforts of the volunteer committee to bring another quality technical program to life.
Marcy LaRont: We’re coming off a highly successful program in 2024. How has the TPC worked together this year and how are submissions of technical papers and posters for this year’s conference?
Stan Rak: I am happy to say we are well represented again this year with TPC members from seven countries and across all different industries. We have 25 members on the TPC, including Udo and myself, which nicely corresponds to the 25th anniversary of the conference. We have some additional expertise from the component manufacturing industry, representatives from Intel and NXP in the semiconductor space, and an EMS company, Flextronics, in the mix this year.
We added Palash Vyas, a recent PhD graduate from Auburn University who co-authored the Best Poster in the 2024 Technical Conference. He works in the automotive electronics industry now. We know he has a good connection with academia, and he was excited to be involved. We also have a returning member, Dr. Laura Cohen of Continental, who has valuable expertise in automotive, aerospace, and energy systems.
LaRont: Have you been receiving a steady flow of papers?
Welzel: It is a similar situation to most years: There is always a period of concern because most contributions tend to come in toward the end of the deadline, but this time, we were very positively surprised. We had anticipated some negative headwinds due to the overall slowing economy in several different countries and that it would cause submissions to be low, but we had about 100 abstract submissions, which is very good. Not all of them made it through, which is part of the normal reviewing process. Julia Flynn, Stan, and myself, as well as our IPC colleagues, were positively surprised when we had the final count.
To read the rest of this article, which originally published in the March 2025 SMT007 Magazine, click here.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
STI Electronics Announces New Recipients of the Jim D. Raby/STI Scholarship
04/22/2026 | STI Electronics Inc.STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract PCB manufacturing, is proud to announce the latest recipients of the Jim D. Raby/STI Scholarship: Ashley Brito, Process Control Technology; June-Ann C. Richards-Owens, Advanced Manufacturing; and Jayden Deon Jones.
Technica Announces Tech Day Event Dates and Agenda
04/13/2026 | Technica USATechnica USA announced today the return of its highly anticipated Tech Day events, marking the revival of a long‑standing customer engagement series. Personal invitations have been issued to customers detailing event dates, participating partners, and the technical agenda.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.