The Shaughnessy Report: Always With the Negative Waves
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
March 5, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Indium Corporation will showcase among its featured products:
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.
- Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
- Indium8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
- CW-807RS is a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
- CW-818 is a halide-free, no-clean cored wire with spatter control technology that provides fast wetting speeds to minimize cycle times in manual and robotic soldering processes.
Share on:
Suggested Items
Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections
04/11/2025 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.
Electra's ElectraJet EMJ110G Powers Seamless Transition at Sunrise Electronics
04/11/2025 | Electra Polymers LtdElectra, in partnership with Allen Woods Associates, is proud to announce the successful deployment of its ElectraJet® EMJ110G Soldermask on KLA’s Orbotech Neos™ platform, now running production at Sunrise Electronics in Elk Grove Village, Illinois.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Capital Expo & Tech Forum
04/11/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on May 8 at George Mason University – Mason Square in Arlington, Virginia.
Best Papers from SMTA International Announced
04/10/2025 | SMTAThe SMTA is pleased to announce the Best Papers from SMTA International 2024. The winners were selected by members of the conference technical committee. Awards are given for "Best of Proceedings" as well as "Best Practical and Applications-Based Knowledge" categories. A plaque is given to primary authors of all winning papers for these exceptional achievements.
AIM Solder and India’s Persang Alloy Industries Announce Strategic Joint Venture
04/10/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 6 at the Crowne Plaza Milwaukee Airport, in Milwaukee, WI. AIM will be showcasing its cutting-edge soldering materials, including Type 5 solder paste offerings.