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BEST Inc. BGA Reballing Service Offers Unsurpassed Solutions for Commercial, Military and Aerospace Applications
March 5, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component services, is pleased to announce it has expanded its BGA reballing solutions. Our BGA reballing process has been perfected over 20 plus years of reballing BGAs for electronic manufacturers across the country. Our capabilities include handling a wide range of package sizes, ball counts and complex arrays to meet our customer needs. BEST’s reballing process follows industry specifications including IPC J-STD-001, IPC 7711, GEIA-STD 0006 and IEC TS 62647-4.
BEST takes great pride in providing the highest quality services to all our customers. Our quality comes from having highly trained operators, strict ESD compliance, MSD controls and exceptional quality control systems in place. When you work with BEST, you get a workmanship guarantee along with exceptional customer service, competitive pricing, and expedited lead time options.
When it comes to reballing BGAs, there are many options out there to choose from. The BEST advantage comes from our years of reballing experience and our ability to make custom reballing performs to fit nearly any package. By making preforms in-house, we significantly reduce lead-times for our customers for both small and large volume jobs.
"Over the past year, we have made significant improvements to our internal efficiencies in order to ensure fast lead times for our customers without sacrificing quality. We are now better equipped than ever to handle orders of any size and turn them around quickly," said Grant Zellmer, Operations Manager at BEST. Currently, lead times for small orders are 3-5 days, while medium to larger orders take 2-4 weeks.
BEST has automated robotic deballing available in compliance with IEC TS 62647-4. This process uses a dynamic solder wave to remove the original solder balls in a touch-free manner. Material traceability, record retention and process qualification procedures are also in place to meet Military and Aerospace requirements for reballing.
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12/03/2024 | HyRelHyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.
PDR Rework Systems Announces New Integrated Reball System for Rework
08/24/2022 | PDR Rework SystemsPDR, a leading manufacturer of BGA rework systems, test and X-ray inspection systems since 1985, announced the release of the firm’s new integrated Reballing system for all PDR Evolution Series Rework Systems.
Accurate Circuit Engineering Expands Services with Addition of Assembly
02/23/2016 | Accurate Circuit Engineering (ACE)Accurate Circuit Engineering (ACE) has officially added assembly to their already extensive list of expert PCB services. In an increasingly competitive market ACE understands the need to offer a complete manufacturing solution to their customers.