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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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PDR Rework Systems Announces New Integrated Reball System for Rework
August 24, 2022 | PDR Rework SystemsEstimated reading time: 1 minute
PDR, a leading manufacturer of BGA rework systems, test and X-ray inspection systems since 1985, announced the release of the firm’s new integrated Reballing system for all PDR Evolution Series Rework Systems.
PDR’s latest reball system now incorporates both solder paste application and reball sphere attach in one easy-to-use system, incorporating advanced nano-technology for a clean, high precision reball method for rework.
This PDR exclusive also incorporates a conveniently integrated excess sphere recovery chamber to capture excess spheres that can easily be accessed on the reball platform for later use, or to accelerate the process when re-balling multiple BGA’s concurrently.
When used with PDR’s ThermoActive Suite Software Reballing Mode profiles, the entire process is simple to use, accurate and provides quality reballing results. This saves both time and money, as well as preventing solder sphere loss due to handling errors.
Although made specifically to integrate into PDR Systems, PDR Reball systems can be used as stand-alone devices for any reballing application where highly accurate reball applications are required.
PDR Reball System are made of high-quality materials and are manufactured with new, state-of-the-art laser technology to ensure highly accurate stencil fabrication and ultra-smooth edge/bore finishes.
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Rachael Temple - AlltematedSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.