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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 7, 2025 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we? So, how do you recover?
IPC APEX EXPO takes place in Anaheim, California, March 18-20, and we’ll be there from ribbon-cutting through the final announcement telling everyone that the show is closed. We’ll be bringing you Real Time with… video interviews with the movers and shakers in PCB design, fabrication, assembly, and test. I’ll be glad to get out of Atlanta—it’s freezing here.
If you’re at the IPC show, stop by our booth and say hello. In the meantime, have a good weekend.
IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
Published March 5
PCB007 Editor Marcy LaRont brings us this review of the first day’s events at the IMAPS Device Packaging Conference in Phoenix this week. As she explains, there was a lot of attention paid to AI and advanced packaging substrates, including glass. I understand the appeal of glass at the packaging level. I’ve heard some PCB fabricators discuss using glass; has anyone on the PCB side ever utilized glass?
UHDI Fundamentals: UHDI Advances Neurotechnology
Published March 5
If you’ve been following Anaya Vardya’s UHDI series, you’re aware that his new technology is a real game-changer. In this installment, Anaya explains how UHDI figures into the development of neurotechnology, especially brain-computer interfaces (BCI). It’s a brave new world for UHDI, and the innovation is only getting started.
Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO
Published March 6
Summit Interconnect has new leadership now, with COO Sean Patterson becoming the company’s first CTO. Michael Norman joins Summit from Raytheon, becoming president and COO. Shane Whiteside will continue as CEO and chairman of the board.
It’s Only Common Sense: Follow Through and Keep Your Promises
Published March 3
Dan Beaulieu really nails it this week: We work in a blizzard of emails and texts, so following up is a real necessity. There’s really no excuse for failing to follow up, and we’re all guilty of this at one time or another. But we all know which of our friends, customers, and suppliers are the most likely to follow up, and they’re the ones we tend to want to deal with. Dan says, “Following through on promises isn’t a common trait.” I’d like to disagree, but he may be right. Check it out.
Recruiting the Next Generation of PCB Designers at Garmin
Published March 6
It’s no secret that we’re running out of PCB designers and design engineers. There are open PCB design jobs around the globe, and there aren’t enough designers to fill these jobs. In this interview, Garmin’s design engineering manager, LB Yates, explains the company’s plans to recruit and train the next generation of PCB designers.
Suggested Items
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Target Condition: Are Autorouters Friend or Foe?
07/01/2025 | Kelly Dack -- Column: Target ConditionFor PCB designers, just hearing the word “autorouters” can trigger everything from eye rolls to heated debate. We all have stories—some painful, some comical—of boards gone sideways at the hands of an overzealous routing algorithm. But these tools aren’t going away, and frankly, they shouldn’t. Used wisely, they can save some project teams hours or even days. Used blindly, they can cost weeks. So, where do autorouting tools stand today, and is interactive routing the smarter path forward?
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.