Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
Target Condition: ‘Boomer to Zoomer: Do You Copy?’
Elementary, Mr. Watson From Classroom to Career—Bridging the Gap in PCB Design Talent
SIA Applauds TSMC’s Expanded Investment in U.S. Semiconductor Manufacturing
March 10, 2025 | SIAEstimated reading time: Less than a minute
The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding the announcement this week by C.C. Wei of TSMC and President Trump. The company plans to increase its U.S. investment in advanced semiconductor manufacturing by $100 billion – to a new total of $165 billion – with three new fabs, two advanced packaging facilities, and an R&D center.
“This week’s announcement by TSMC and President Trump is a major win for America’s economy, supply chain security, and domestic production of the advanced chips that propel AI and many other transformative technologies of the future. Since TSMC’s initial U.S. investments announced during President Trump’s first term, companies across the semiconductor ecosystem have committed to invest more than half-a-trillion dollars in America. We applaud TSMC for investing boldly in the United States and look forward to continuing to work with leaders in Washington to advance policies that promote America’s economic strength, national security, and technology leadership.”
Share on:
Suggested Items
Teradyne Announces Succession Plan for Semiconductor Test Division
03/07/2025 | BUSINESS WIRETeradyne, Inc. announced that Shannon Poulin has joined Teradyne to succeed Rick Burns as President of the Semiconductor Test Division in Q2 2025. Mr. Burns plans to retire on June 1, 2025.
Statement from IPC, the Global Electronics Association, on Recent U.S. Tariffs and Global Trade
03/07/2025 | IPCIPC shared the following statement today on U.S. tariffs and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:
Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO
03/06/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing solutions, is pleased to announce two key leadership updates to its executive team.
IPC Strengthens Its Global Executive Leadership Team
03/04/2025 | IPCIn an effort to strengthen service to its more than 3,200 corporate global members, IPC announces the transition of two of its executive leadership staff into new IPC roles.
Samsung Display Partners with Intel to Target Next-Gen AI PC Market
02/24/2025 | Samsung Display CompanySamsung Display has signed a Memorandum of Understanding (MoU) with Intel®, a global semiconductor company, showing both companies’ intent to cooperate in the development of next-generation IT technology and joint marketing efforts.