INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation

Estimated reading time: 1 minute

The fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections. Finer trace widths and spaces will need better AOI optics that reduce the field of view and depth of focus while addressing warpage issues as well as organic panel shrinkage.

AOI Inspection and Measurement Study

Phase 4 of INEMI’s Panel Level Package Fine Pitch Substrate Inspection/Metrology Project was launched to characterize the current capabilities of AOI metrologies as well as to understand future trends for AOI measurement and inspection technologies. The project team has designed and fabricated a test vehicle and will be conducting a study to determine AOI inspection capabilities with the objective of identifying technical difficulties and gaps between current capabilities and user needs. Analysis will include the level of detectability by defect types and defect sizes.

This webinar will share information about test vehicle design and the testing plan. INEMI is looking for industry participation to help compile the data required for analysis. We are seeking input from test equipment manufacturers and substrate fabricators, along with package assembly companies and OEMs using advanced packaging technologies.

About the Speaker

Feng Xue, Senior Technical Staff Member
IBM

Feng Xue is a Senior Technical Staff Member at IBM Systems Supply Chain Engineering. He has 20 years’ experience in semiconductor technology and supply chain operation. In his current role as Chief Architect for Supply Chain Quality System Solutions, he is leading initiatives on internal quality management systems, supplier quality programs, business analytics, app modernization and cloud-native apps for quality processes, AI and IIoT solution deployment and Industry 4.0 transformation.

Registration

This webinar is open to industry; advance registration is required. If you have any questions or need additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).

Wednesday, March 26
9:00-10:00 a.m. EDT (North America)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)

For additional information and registration, click here.