Würth Elektronik: Wi-Fi Module for IoT Security
March 11, 2025 | Würth ElektronikEstimated reading time: 2 minutes
Würth Elektronik introduces its new Cordelia-I Wi-Fi module, specifically designed for secure IoT and ‘edge computing’ applications. This versatile module is ideal for applications in Industry 4.0, Smart City / Smart Home, eMobility, smart agricultural, and medical devices, to name a few. It meets the requirements of RED (Radio Equipment Directive) including the Cybersecurity Regulation 2022/30 in accordance with EN 18031-1, which will become mandatory for all devices with radio technology in the EU as of August 2025. The Cordelia-I module was developed in collaboration with British cybersecurity company Crypto Quantique – to ensure the highest security standards. With a compact size of just 19 × 27.5 × 4 mm, it is designed to operate over a temperature range of -40 °C to +85 °C, and consumes less than 10 μA in standby mode.
The new Wi-Fi module from Würth Elektronik independently manages secure cloud connections, thus reducing the workload on the host MCU. MQTT over TLS is used as the primary protocol for connecting to the cloud. The module features a secure Root of Trust (a fundamental security concept in information technology) that is unique and tamper-proof. All cryptographic keys are securely generated and stored within the module.
Cordelia-I supports cloud connectivity via Crypto Quantique's QuarkLink platform, ensuring secure and scalable zero-touch provisioning as well as cloud onboarding of the end device in the field. This SaaS platform (Software as a Service) allows implementation of the first security layer for an IoT device. The necessary steps include: secure provisioning of devices, onboarding with a cloud service provider or an in-house server-based application, and managing the devices throughout their lifecycle.
The Cordelia-I module complies with the IEEE 802.11 b/g/n Wi-Fi standard and operates in the 2.4 GHz band. In Transparent Mode, it provides a secure UART-to-Cloud bridge. The transmission power goes up to +18 dBm (peak), while the receiver sensitivity is -92 dBm.
Würth Elektronik offers an evaluation kit, SDK and PC tools for evaluation of this product as an additional service. This simplifies the development of hardware and software for IoT applications using Cordelia-I.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Protecting Advanced Trucking Electronics in Harsh Environments
05/13/2026 | Beth Massey, MacDermid Alpha Electronics SolutionsFor decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.
Global Direct-to-Cell Market to Grow 49% YoY in 2026, Unlocking New Supply Chain Opportunities
04/27/2026 | TrendForceDirect-to-Cell technology is rapidly maturing as global mobile communications standards 3GPP Release 17 and Release 18 continue to incorporate satellite communications.
Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.
UHDI Fundamentals– Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2
04/16/2026 | Anaya Vardya, American Standard CircuitsIn the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.
Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026
02/10/2026 | TrendForceGoogle’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design.