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INEMI Publishes Roadmaps for Board Assembly and Complex Integrated Systems and Expands PCB Roadmap to Include Laminates

06/18/2025 | iNEMI
The International Electronics Manufacturing Initiative (INEMI) has published content on three new roadmap topics in key areas of electronics systems: board assembly, complex integrated systems and laminates.

Webinar: INEMI Printed Circuit Board Roadmap

06/13/2025 | iNEMI
Join INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany.

INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect

06/09/2025 | iNEMI
One of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.

INEMI Announces Board of Directors Election Results

04/16/2025 | iNEMI
The International Electronics Manufacturing Initiative (INEMI) has announced results from its recent Board of Directors election. The consortium’s members have added one new director and re-elected four incumbents.

iNEMI Hosts Two Sessions at IPC APEX EXPO, Focus on Roadmap for PCB, Assembly, and Laminates

02/26/2025 | iNEMI
The International Electronics Manufacturing Initiative (INEMI) will have two forward-looking sessions at the upcoming IPC APEX EXPO in Anaheim, California (March 18-20). Both sessions are open to conference attendees with a (free) Event Essentials Pass. The two sessions are outlined below.
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