INEMI Publishes Roadmaps for Board Assembly and Complex Integrated Systems and Expands PCB Roadmap to Include Laminates

Estimated reading time: 2 minutes

The International Electronics Manufacturing Initiative (INEMI) has published content on three new roadmap topics in key areas of electronics systems: board assembly, complex integrated systems and laminates.

The Board Assembly and Complex Integrated Systems roadmaps are crucial because they provide a structured approach to addressing the increasing complexity of electronic systems. As technology advances, industries such as high-performance computing, 5G/6G wireless communications, autonomous driving, medical electronics, and aerospace and defense require more sophisticated integration of components — from chips to packages to boards. The INEMI Roadmap helps ensure that the right technologies mature at the right time for the electronics manufacturing ecosystem to realize those hardware systems.

The new content covers the following:

• Board Assembly — This topic maps out critical challenges and technology advances in assembly materials, surface mount technology, rework and repair, press fit, and CPU sockets. The work was led by Jasbir Bath (Bath Consultancy LLC) and Paul Wang (MiTAC).
• Complex Integrated Systems — Builds on the recent cross-industry whitepaper led by INEMI and IPC, “Complex Integrated Systems: The Future of Electronics Manufacturing,” adding roadmapping data to define key challenges and technology solutions.
• Laminates — The PCB Roadmap has been expanded to include laminates. This new section  summarizes the technical needs that must be met by future laminate technologies, the associated gaps and the potential technology solutions. This work was led by Tarja Rapala (EIPC) and Joe Beers (Gold Circuit Electronics).

“Through these three roadmapping topics, INEMI re-affirms its focus on the manufacturing realization of increasingly complex electronics applications,” says Francis Mullany, INEMI Director of Roadmapping. “Ever-more demanding functional requirements challenge manufacturing processes such as board assembly and laminate production with increased miniaturization, faster switching speeds, and operations in harsher ambient environments.” 

Highlights: Needs & Challenges

Some of the needs and challenges highlighted by this new content include:

• SMT (surface mount technology) printing processes are incorporating increased automation for fast product changeover and process control.
• As the number of pins continue to exponentially increase, socket sizes increase, making warpage a key consideration. Solutions needing development include new low CTE materials, socket mold design optimization, increasing material strength and partition of sockets into multiple pieces.
• Standardization across multiple domains is critical for increasing complexity in integrated systems for supply chain traceability, for data exchange within EAD (electronic design automation) flows, and for chiplet physical form factors and interfaces.
• Continued evolution of semi-additive technologies (SAP/MSAP) is needed to address miniaturization in laminates. This change, along with other process innovations for smaller features, will drive investment for improved cleanroom environments, increased machine and handling accuracy, and reduced equipment-induced ESD (electro-static discharge).