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PCB West Keeps the Momentum Going

10/08/2026 | Marcy LaRont, I-Connect007
The weather couldn’t have been nicer for PCB West 2026 last week at the Santa Clara Convention Center in California. As soon as I walked into the conference on Tuesday afternoon, I saw old friends and colleagues. The energy was high and overwhelmingly positive during the four-day event, which featured 70 technical sessions and events, including 10 free sessions on Wednesday, the day of the Expo.

Real Time with... THECA 2026: FSQuality Expands Thailand Capacity for Advanced PCB Markets

09/03/2026 | Real Time with... THECA
Ben Huang, sales director of Europe and America at FSQuality, explains how the company's new Thailand facility is targeting AI, automotive, and industrial applications while transferring manufacturing expertise from China and growing into advanced manufacturing capabilities with processes such as mSAP.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

Knocking Down the Bone Pile: X-ray Inspection of Ball Grid Array Solder Joints

08/07/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) devices are ubiquitous in electronic products primarily due to their advantages, including compact packaging, greater durability than leaded devices, and improved performance from shorter signal paths. BGAs improve electrical performance by reducing inductance and capacitance between the internal silicon die and the PCB, resulting in superior signal integrity and faster operation speeds. BGAs also offer superior thermal performance by dissipating heat more effectively, reducing the risk of overheating.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... UV Curable Conformal Coatings

06/09/2026 | I-Connect007
Chapter 1: Options for Protecting Electronic Assemblies and a Deep Dive into UV Conformal Coatings. Electronics, depending on fit and function, have different protective options including conformal coatings, potting materials, encapsulants, protective enclosures, sealing and gaskets.
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