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VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones

06/09/2025 | BUSINESS WIRE
VeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.

Top Investment Certification on 2nd Anniversary Boosts ESCATEC’s European Presence

06/09/2025 | ESCATEC
Two significant milestones in recent days by ESCATEC’s business unit in Bulgaria adds much momentum to the EMS provider’s strategy to nearshore cost-effective and high-quality electronics assembly and plastic moulding services for its customers in the European Union.

Growing Demand for Mid-Size Displays Opens New Opportunities for FMM-Free OLED Technologies

06/05/2025 | TrendForce
TrendForce’s latest report on the display industry reveals that OLED technology—valued for its self-emissive structure, high contrast ratio, and lightweight design—continues to expand its market presence, primarily in small-size applications such as smartphones.

Würth Elektronik and HKSTP Sign New Engineering Service Program

06/05/2025 | Wurth Elektronik
Würth Elektronik and the Hong Kong Science and Technology Parks Corporation (HKSTP) have signed a comprehensive cooperation agreement to promote development and production in Hong Kong. Around 100 start-ups and Small and Midsized Enterprizes (SMEs) in the field of microelectronics, as well as Hong Kong's entire production ecosystem, will benefit from local development support, knowledge transfer, and partner network of the well-known component manufacturer.

Orbel Corporation Integrates Schmoll Direct Imaging

06/04/2025 | Schmoll America
Orbel Corporation in Easton, PA, proudly becomes the first PCM facility in the U.S. equipped with Schmoll’s MDI Direct Imaging system. This installation empowers Orbel to support customers with greater precision and quality.
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