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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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IPC APEX EXPO 2025: And So It Begins
March 18, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
The IPC APEX EXPO 2025 show floor opens today, but technical, educational, and, of course, standards committee work has been underway during the preceding weekend. In typical spring fashion, the weather has vacillated between sunny and warm to a spot of rain late on Monday afternoon just as many conference goers were headed back to their nearby hotels.
The Anaheim Convention Center has been equally busy with a nearby conference of the American Physics Society, making for an interesting confluence of young and old seeking to learn more about their chosen scientific field. Equally, the APEX EXPO show floor has been abuzz with movers setting up the hundreds of booths as IPC gets ready for a ribbon cutting and keynote speaker to kickoff the week’s activities.
Vendors, suppliers, customers, and decision-makers all have the chance to put all the R&D and standards into practical application.
This year, IPC is celebrating IPC APEX EXPO’s 25th year. Part of the program includes a number of retrospectives and will look back at the show’s early days.
Hot topics already include AI concepts and applications, advanced packaging, ultra HDI, and inter-machine data exchange. Undoubtedly, today’s show events will include a number of announcements related to new products and new programs. We look forward to attending the new Learning Lounge, visiting the IPC Mexico pavilion, learning more about the student posters, and attending the special tech sessions.
Managing editors at I-Connect007 also will be interviewing dozens of industry decision-makers and influencers in our booth for our Real Time with… program. Be sure to stop by and check out the action. While you’re there, pick up material on our book program, and take a selfie with your “electronic wings.” As always, IPC APEX EXPO never disappoints.
Be sure to join us as we cover all the news and events here in Anaheim. We’ll be posting on our website and at www.realtimewith.com.
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Julia McCaffrey - NCAB GroupSuggested Items
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.