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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/29/2026 | Michelle Te, I-Connect007
This week’s picks all seem to circle around one bigger reality: The electronics industry is rebuilding itself in real time. Whether it’s investing in workforce development, reshaping manufacturing processes, modernizing how we communicate with readers, or strengthening domestic advocacy, there’s a noticeable shift from simply reacting to challenges toward actively building long-term infrastructure.

Meet Emerging Engineers Ahmon Brooks-Starks and Nicolas ‘Cole’ Gregory, Summit Interconnect

05/29/2026 | Michelle Te, I-Connect007
While attending the Newcomers Reception at APEX EXPO 2026, I visited with Ahmon Brooks-Starks and Nicolas “Cole” Gregory, two new members of the Global Electronics Association’s Emerging Engineer Program. You might be a bit surprised at their backgrounds, but (hint) having a foundation in science has translated well into their jobs at Summit Interconnect.

Don't Buy AI, Learn It: A Fabricator's Guide to Getting Started, Part 1

05/27/2026 | Sean Patterson, CrossGen AI
The first hard truth about AI in PCB fabrication is that you can buy software, but you cannot buy capability. You can sign a contract, schedule demos, put a few logos on a slide, and tell your team you now have an AI strategy. Plenty of companies are doing some version of that right now. But if the people in your plant do not know how to use AI in real work, then your purchase was more akin to buying a gym membership and never going. (Don’t take that as criticism; it’s just how it works.)

Navigating the Hidden Hurdles: Mastering Return Path Discontinuities for Robust Signal Integrity

05/26/2026 | Stephen V. Chavez, Siemens EDA and PCEA
In the race toward higher bandwidth, tighter form factors, and faster time-to-market, engineering teams focus heavily on device performance, routing density, and advanced materials. Yet one of the most critical determinants of system success remains largely invisible—and too often underestimated: the integrity of the return path. Signal integrity (SI) failures rarely originate from the signal trace alone. More often, they stem from what designers don’t see—the disruption of the signal’s return path. These disruptions, known as return path discontinuities, are a leading cause of late-stage failures, unexpected EMI issues, and costly respins.

Fujitsu Develops Self-Evolving AI Agent Technology for Business Operations

05/25/2026 | JCN Newswire
Fujitsu Limited announced the development of a self-evolving multi-AI agent technology that enables multiple AI agents to perform tasks as a team, continuously and safely learning from daily execution results, human feedback, policy revisions, and specification changes.
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