DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI

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DuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo, March 18-20, in Anaheim, California.

DuPont will share recent developments across its innovative portfolio of advanced interconnects and thermal management solutions designed to meet the complex performance demands of high-tech sectors, including aerospace & defense, automotive, and artificial intelligence (AI).

• In Aerospace, DuPont™ Pyralux® laminates and Kapton® polyimide films are vital for high-profile projects, like the James Webb Space Telescope and the Mars Rover, providing the reliability needed for extreme space conditions.
• In Defense, laminate materials that form the backbone of PCBs and flexible circuits, used in a multitude of applications, from avionics to missile guidance systems.
• For AI, DuPont's solutions are tailored to meet the performance and reliability requirements of AI technologies, enhancing capabilities across chip packages, IC substrate, printed circuit boards (PCBs) and thermal management to support effective functioning in demanding environments.
• In EV packaging, DuPont Advanced Flex Technologies address key challengesrelated to electromagnetic interference (EMI) and thermal management withinelectric vehicle (EV) battery architectures, playing a crucial role in optimizingperformance and safety as EV demand rises.

“From powering deep-space exploration to driving the next generation of intelligent systems, our solutions help shape the future of electronics,” said Thean Ming Tan, global business director, Advanced Flex Technologies, DuPont  Interconnect Solutions. “We’re excited to engage with industry leaders at IPC APEX Expo, demonstrating how DuPont’s expertise continues to push the boundaries of what’s possible in these demanding environments and applications.”

DuPont ICS will exhibit in the Insulectro booth 4138 where company experts will participate in the Insulectro PowerChats, presenting on a range of topics and capabilities, and will also share booth 3916 with Tritek Circuit Products. Key ICS products and capabilities to be featured at the show:

• DuPont™ Pyralux® laminated circuit materials, including Pyralux® ML double-sided metal-clad laminates – the newest addition to the Pyralux® family – designed for thermal management.
• DuPont™ Kapton® - the gold standard in polyimide films, offering exceptional versatility and superior thermal performance, designed to excel under extreme conditions.in automotive, aerospace, electronics and medical applications.
• Silveron™ GT-210 Durable Silver electroplate designed for electrical contact applications requiring high conductivity, tolerating high temperatures with durability exceeding that of hard gold.
• DuPont™ Riston® advanced dry film photoresists, offering high yield,
• productivity, and ease of use in imaging applications
• Interra® thin copper-clad laminates, designed for use as embedded-capacitance materials in multilayer rigid PCBs to offer industry-best mechanical strength, reliability and capacitance stability.
• CopperGleam™ PPR-III pulse acid plating copper designed for through-hole plating with high mechanical and thermal reliability.