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Long-time Industry Icon Peter Bigelow Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2025
March 20, 2025 | IPCEstimated reading time: 1 minute
In recognition of his extraordinary contributions to IPC and the electronics manufacturing industry, Peter Bigelow, president of FTG Circuits Haverhill, was inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2025. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service to and advancement of IPC and the electronics industry.
Active in the printed circuit board industry (PCB) for more than 30 years, Bigelow was honored for his enthusiastic support of IPC’s mission to serve the electronics industry as an advocate for standards development and committee programs. He served on the IPC Board of Directors for 11 years, helping to shape IPC’s strategic objectives and enhance IPC’s position as the voice for the electronics industry supply chain.
He has been actively involved with the PCB Management Council and numerous professional development programs and task groups, especially those related to industry compliance challenges and the development of standards that assure trusted suppliers and secure supply chains. He is also a member of the IPC Thought Leaders Program. He is a member of eight IPC committees, serving as Chair of the PCB/IMS Presidents Management Council Steering Committee. He is a member of the Government Relations Grassroots Participants, the Trusted Supplier Task Group, the Cybersecurity Protection Standard Task Group, and two IPC A-Teams.
Bigelow has extensive experience in general management, marketing, operations, and sales with large publicly traded and privately held manufacturing companies in the printed circuit, electronics, and instrumentation industries. He is President of FTG Circuits in Haverhill, Mass., focusing on the military, RF/ microwave, and aerospace markets. For 22 years before its acquisition by FTG, Peter was CEO of IMl, Inc., a leading AS9100, MIL, and IPC-1791 certified and ITAR-registered fabricator of PCBs and substrates. Before that, he was president of Beaver Brook Circuits.
“Peter has been a true leader and innovator in the global electronics industry and has made immense and long-lasting contributions to IPC and to electronics manufacturing,” said John W. Mitchell, IPC president and CEO. “We are thrilled to welcome him as the newest inductee into the IPC Hall of Fame.”
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.