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IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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NextFlex Launches $5M Funding Opportunity to Strengthen US Electronics Industrial Base
March 20, 2025 | PRNewswireEstimated reading time: 1 minute
NextFlex, the Department of Defense (DoD) sponsored manufacturing innovation institute focused on maturing hybrid electronics, released Project Call 10.0 (PC 10.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing. The total PC 10.0 project value is expected to exceed $10 million (including NextFlex investment and performer cost share), bringing the total anticipated investment in advancing hybrid electronics since NextFlex's formation to more than $165 million.
Building from the success of past project calls, PC 10.0 uses broadly defined topics to enable a diverse proposer base, with special emphasis on areas in which hybrid electronics can impact high-priority U.S. manufacturing opportunities and areas of emerging importance within the electronics manufacturing community. PC 10.0 emphasizes projects that focus on solving manufacturing challenges and demonstrate key capabilities enabled by hybrid electronics.
"Since NextFlex was established nearly a decade ago, the institute, its members, and Department of Defense partners have worked together to roadmap and advance hybrid electronics technology and manufacturing through collaborative technical projects. With PC 10, we continue this history of addressing the priorities of the U.S. manufacturing industrial base to strengthen its ability to meet both commercial and defense requirements," said Dr. Scott Miller, NextFlex director of technology.
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Driving Sustainability in PCB Design
04/24/2025 | Marcy LaRont, I-Connect007Filbert (Fil) Arzola is an electrical engineer at Raytheon. He’s smart, entertaining, and passionate about PCB design. As it turns out, he’s also passionate about “Mother Earth,” as he calls her. Born and raised in Southern California, he freely admits that he turns the water off when he brushes his teeth and yells at his brother for throwing batteries in the garbage. But when looking at the issue of sustainability and PCB design, he urges his audiences to ponder what sustainability looks like. Can PCB designers, he asks, make any impact on sustainability at all?
Real Time with... IPC APEX EXPO: Silicon Geometry's Signal Integrity Impact on PCBs
04/24/2025 | Marcy LaRont, I-Connect007At IPC APEX EXPO 2025, Kris Moyer addressed the importance of understanding the impact of silicon geometry reduction on signal integrity and PCB performance. Kris says signal integrity considerations are necessary for so many designs today, regardless of clock frequency. He discusses valuable insights from attendees regarding embedded resistor technology and the effects of radiation on smaller silicon features in aerospace applications.